What is the AOI inspection equipment in the PCB industry mainly used to detect

AOI is an automatic optical inspection system, and what it can do is to open and short circuit on the circuit board, that is, disconnect the wire. The opening and short circuits on the surface can be detected, and he can't do the rest.

However, this is also to be combined with the data in the project, it needs to get the original data in order to have a reference object in order to distinguish the error information that is different from the original reference.!!

That's it.

I am in the PCB industry, AOI is the abbreviation of the first letter of the English automatic optical inspection, the main role of the application of the road board industry is to carry out optical scanning of the circuit board after making (after etching) to check whether the circuit board has defects (such as short circuit, open circuit, etc.).

However, it can only detect whether the shape of the plane is different from the design, and cannot detect problems in the vertical direction (such as whether there is a problem in the hole).

Please refer to it!

It can detect the 2D effect of components and pads on the PCBA, but cannot detect the red glue and 3D effect temporarily.

The main detection line is our open and short circuit.

It is mainly used to detect many defects of PCBA, such as wrong parts, offset, floating height, warping angle, etc., our company uses the products of good Leichen Technology with good reputation in the industry.

a. Design check.

The following checklist covers all aspects of the design cycle, and for particularly noisy applications, additional items should be added.

1. General projects.

1) Have you analyzed the circuit? In order to disturb the smoothing signal circuit, divide it into basic units, no?

2) Is it permissible for the circuit to use short or isolated critical leads?

3) Where it must be shielded, is it effectively shielded?

4) Make the most of the basic grid graphics no?

5) Is the size of the printed board the best size?

6) Do you use the selected wire width and spacing whenever possible?

7) Is the preferred pad size and hole size used?

8) Are photographic negatives and sketches appropriate?

9) Are the jumper wires used the least? Do jumper wires need to pass through components and accessories?

l0) Can the letters be seen after assembly? Is it the right size and model?

11) In order to prevent blistering, is there a window for a large area of copper foil?

12) Is there a tool positioning hole?

2. Electrical characteristics.

1) Have you analyzed the effects of wire resistance, inductance, and capacitance? In particular, is there an impact on the critical pressure drop phase grounding?

2) Does the spacing and shape of the wire accessories meet the insulation requirements?

3) Is the insulation resistance value controlled and specified in key places?

4) Is polarity adequately identified?

5) Is the influence of the wire spacing on the leakage resistance and voltage measured geometrically, and 6) Is the medium that changes the surface coating layer identified?

3. Physical characteristics.

1) Are all pads and their positions suitable**?

2) Can the assembled printed board meet the impact and vibration work conditions?

3) What is the spacing of the specified standard elements?

4) Are the components that are not well installed or the heavier parts fixed?

5) Is the heat dissipation and cooling of the heating element correct? Or is it isolated from printed boards and other thermal components?

6) Is the voltage divider and other multi-lead components positioned correctly?

7) Is the arrangement and orientation of the components easy to inspect?

8) Are all possible interferences on the PCB and on the entire PCB assembly eliminated?

9) Is the size of the positioning hole correct?

10) Are the tolerances complete and reasonable, and 11) Are the physical properties of all coatings controlled and signed?