How chips are made 5, how chips are made

Here's how the chip is made:

1. Chip design.

Chips are small in size, but high precision is extremely high-precision products. If you want to make a chip, design is the first step. The design requires the help of EDA tools and some IP cores, and finally makes the chip design blueprint required for processing.

2. Sand and silicon separation.

All semiconductor processes start with a grain of sand. Because the silicon contained in the sand is the raw material needed to produce the "ground-based" silicon wafers of the chip. So our first step is to separate the silicon from the sand.

3. Silicon purification.

After the silicon is separated, the rest of the material is discarded. Silicon is purified in multiple steps to achieve quality that is consistent with semiconductor manufacturing, which is known as electronic-grade silicon.

Fourth, the silicon ingot.

After purification, the silicon is cast into ingots. A single crystal of electronic-grade silicon after being cast into ingots, weighing about 1 kilogram, achieves the purity of silicon.

5. Wafer processing. After the silicon ingot is cast, the entire silicon ingot is cut into a piece of disc, which is commonly known as the wafer, which is very thin. The wafer is then polished until it is perfect and the surface is as smooth as a mirror.

The diameter of silicon wafers is commonly 8 inches (2 mm) and 12 inches (3 mm), the larger the diameter, the lower the final cost per chip, but the more difficult it is to process.

6. Lithography. First, three layers of material are applied to the wafer. The first layer is silicon oxide, the second layer is silicon nitride, and the last layer is photoresist.

The designed chip blueprint containing billions of circuit components is then made into a mask, which can be understood as a special projection negative, which contains the chip design blueprint, and the next step is to transfer the blueprint to the wafer. This step places extremely high demands on the lithography machine. Ultraviolet light shines through the mask onto the photoresist on the silicon wafer, and during the photolithography process, the photoresist under the ultraviolet light is dissolved, leaving the same pattern as on the mask.

The exposed wafer is dissolved with chemicals, and the remaining photoresist protects the part that should not be etched. Once etching is complete, remove all photoresist to reveal the grooves.

7. Etching and ion implantation. The first step is to corrode away the silicon oxide and silicon nitride exposed to the photoresist, and precipitate a layer of silicon dioxide to insulate the transistors, and then use etching technology to expose the bottom layer of silicon. Boron or phosphorus is then injected into the silicon structure, then filled with copper to interconnect with other transistors, and then another layer of glue can be applied on top to create another layer of structure.

Generally, a chip contains dozens of layers, like a densely intertwined highway.

After the above process, we have a silicon wafer full of chips. The chip is then cut off the wafer with a fine cutter, soldered to the substrate, and sealed in a case. After the final test session, the chips are ready.

First pick up the main quest at Kelly's.

The task of making jamming chips.

Kelly swapped 10 dazzling, 2 white, and 5 spikes for Cocamu chips.

Sherlock swapped the cocamu chip for the capsule.

A capsule will only prescribe one thing.

Either a defective chip or a black and hard substance.

Both of them are very useful.

Repeat, repeat, you can put it away.

A chip between 25-28W is considered normal.

After 30w, it is expensive.

What you get after completing the quest is:

Jamming transmitters.

Then GSD will have a new task here.

It's also the main story.

Make soul-calming incense.

The condition is 10 black hard.

The method of obtaining it is the same as the method of obtaining ...... chip

Completing this quest will reward you with a Rose Vine Bracelet.

Oh, by the way.

If you don't do these two main quests 37, you won't be able to receive the GBL Believer's Medal Quest

The answer is supplemented. After arriving at 34, take over the task of "making jamming transmitters" here at "Kelly".

Then give 10 dazzling crystals, 2 large white crystals, and 5 sharp spikes to Kelly to get a quest chip.

Then go to Sherlock and give it the chip and 1w gold to get a compressed capsule.

There are three items in the compressed capsule:

1.It's the small chip you want.

2.It is a defective chip.

3.It's a hard and black substance.

Defective. At least 15-180,000 pieces.

It is impossible to receive 3 out of 10.

Hehe, do you have the idea of making chips?

First of all, you have to figure out what your chip is for and what it does.

It is then expressed in a circuit diagram. This requires a lot of knowledge of logic operations in gate circuits and digital electronics. Then let's talk about this complex circuit diagram to simplify. The result is a minimal circuit diagram.

In accordance with the requirements in the circuit diagram, all gates and circuits are connected. You can implement the function.

Of course, the chips are still far from here. Metal is selected, and pure gold is generally used as the conductor for high-tech integrated circuits. It is embedded in an insulating board, and then the gate circuit is simplified again, reduced, etc.

The last board obtained is a high integrated circuit. The technology is very demanding.

First of all, you need to provide a complete circuit diagram and PCB board diagram.

Then find a manufacturer specializing in the production of chips to customize.

However, the cost is relatively high if the production quantity is small.

I love you. I love you, I want to be stubborn to the limit.

Look up at the stars together.

Get out of the forest. Taste together.

Memories together. Misunderstanding jealousy.

It rained together and the sky was clear.

Together, we understand ourselves better, and we find meaning together.

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A chip is a conventional term that integrates a microprocessor and some other device on a small circuit board through integrated circuits to form the core part of a computer.

In the past, circuits were circuits made up of discrete components held together. After the invention of the transistor, the integrated circuit was invented in 1961. This is a revolution in circuit design.

It connects the various components of the entire transistor circuit and makes them on a semiconductor substrate at the same time to form an inseparable whole, breaking the concept of the original circuit, breaking the design method of the original discrete components, and realizing the unity of materials, components and circuits. Chip.

Answer hello. Chip is a general term for semiconductor component products, also known as microcircuits, microchips, and integrated circuits. Refers to a silicon wafer containing an integrated circuit, which is small in size and is often part of a computer or other electronic device.

Semiconductor is a general term for a class of materials, integrated circuits are a large collection of circuits made of semiconductor materials, and chips are products formed by different types of integrated circuits or single types of integrated circuits.

If the CPU of the processor is compared to the heart of the entire computer system, then the chipset on the motherboard is the torso of the entire body. For the motherboard, the chipset almost determines the function of the motherboard, which in turn affects the performance of the entire computer system, and the chipset is the soul of the motherboard.

The chip manufacturing process is roughly divided into the following steps:

1.Raw materials for single wafers: The raw materials for chip manufacturing are mainly silicon wafers, which are round thin wafers of high-purity silicon.

2.Lithography technology: On the silicon wafer, the circuit pattern that needs to be searched and made is repaired with special equipment, that is, color photography (photolithography), and then the pattern is formed by chemical means.

This process needs to be repeated many times, gradually forming a complex circuit pattern.

3.Nitride layer and electrode connection: A nitride layer is added between the silicon wafer and the electrode to protect the chip from chemical reactions. Then, the electrodes of the entire chip are connected, and the connection is made using spark erosion technology.

4.Reinforced metal material: Enhance the strength of the chip and protect the chip from damage. The reinforcing material can be different metal or plastic materials, or it can be fiberglass, etc.

5.Cleaning and Testing: Cleaning the chips to guarantee their purity and smoothness. Then the electrical performance test and acoustic test are carried out to ensure that the chip meets the performance requirements.

The working principle of the chip is based on lithography technology and microelectronics technology, and it is made of semiconductor materials such as masks and photolithography and integrates many transistors into the optical controller (MOS) structure. When an external mold leak compass applies a certain amount of current or voltage, the chip can perform different functions, such as computing, storage, and communication. The design and manufacturing process of the chip structure are very delicate to ensure the performance and stability of the chip.

Chip manufacturing processes: photolithography, etching, thin film (chemical vapor deposition or physical vapor deposition), doping (thermal diffusion or ion implantation), chemical mechanical planarization CMP.

Monocrystalline silicon wafers (or III-V groups such as gallium arsenide) are used as the base layer, and then components such as MOSFETs or BJTs are made using lithography, doping, CMP, etc., and wires are made using thin film and CMP technologies.

Due to product performance requirements and cost considerations, the wire can be divided into aluminum process (mainly sputtering) and copper process (mainly electroplating, see Damascene). The main process technologies can be divided into the following categories: yellow light microshadow, etching, diffusion, thin film, planarization, metallization.

Do you know how chips are made?

The quantum chip I worked on is about to come out, and the United States will be defeated.