What is the minimum process of China s domestic lithography machine?

The minimum process of China's domestic lithography machine] The minimum process of China's current domestic lithography machine is 90 nanometers. It is not difficult to upgrade from 90 nm to 65 nm. But 45 nanometers is a technical step.

45nm is much more difficult to develop than 90nm and 65nm. If 45 nm is solved, it is not difficult to upgrade to 32 nm. But the next step is to upgrade to 22nm, and you can't directly upgrade from 45nm to 22nm.

22nm uses a lot of new technologies.

02 of China's 16 major projects were proposed. In 2015, the lithography machine will be industrialized at 45 nanometers and 65 nanometers, and by 2020, it will be industrialized at 22 nanometers.

Lithography machine] also known as: ultraviolet machine, mask alignment machine, system, lithography system, etc. The commonly used lithography machine is mask alignment lithography, so it is called mask alignment system.

The general photolithography process needs to go through the processes of silicon wafer surface cleaning and drying, priming, spin coating photoresist, soft drying, alignment, post-baking, development, hard drying, etching. It is a process in which the surface of a silicon wafer is homogenized, and then the pattern on the reticle is transferred to the photoresist, and the device or circuit structure is temporarily "copied" onto the silicon wafer.

The lithography machine does not know. At present, the best process in China is 65nm, which is almost 90, and a large number of factories stay at the level. SMIC is said to have taken 45, but there was no movement.

Chinese mainland national pre-production lithography machine due to just solved the light source problem, the current mass production is 90 65nm, 45nm prototype has come out, can be used for 28nmhkmg process production of the national prototype, planned to come out at the end of 2020 around 2021, around 2025 can produce 14 10nm machine, the first generation of EUV 7 5nm machine is planned to be localized in 2030. The second and third generation EUV and GAA surround gate transistor technologies with high numerical aperture below 5nm are still in the pre-development stage of drawings.

Lithography machines are difficult to produce, this thing is a technical difficulty for us, or a technical barrier, we don't have such technology, even if there is precision, it is not enough. It can't meet the requirements of the actual production needs now, and the real production of this thing cannot be done by a single manufacturer. <>

A really high-end lithography machine, not to mention that it is still in the experimental stage, the two-nanometer one, that is, the 5-nanometer and seven-nanometer machine, basically only a limited number of foreign manufacturers can produce it. They can produce not that the technology is their own, but that they have technical exchanges with many other cutting-edge technology companies in the world, thousands of companies, that is, each company is responsible for a part of the precision parts, and then only a few companies in the world, they have such a relatively complete product**. And then I have the key assembly technology myself, and there are some major framework technology core technologiesIn their own way, they were able to build a lithography machine that was actually ready for production.

And foreign countries are very conservative about this thing, that is, a unified attitude, if you want to make chips, we can give you OEM, we can help you produce, you just give money. But you can't want a lithography machine, and you can't sell it to you no matter how much money you give, just don't sell it. It's not a matter of money, this thing is priceless in the market, don't say 1 billion, you just pay more money and no manufacturer dares to sell it to you,This is not just a question of commercial companies, it is a question of technical barriers between countries.

This thing is very important, because the smart devices you usually use, mobile phones, smart bracelets, computers, including TVs, will have chips in it, and some chips and some chips can be made by ourselves. But the real high-end chips, we still don't have this machine now, this is the design ability that we have gradually now, we can develop it, but we can't mass production, there is no really high-end chip, and we have to rely on foreign companies to foundry. But now they're blocking youIf people don't give you OEM, this matter will be very troublesome, and we will definitely concentrate resources and strength on these technologies in the future, but this is really not something that can be done in the short term.

It's very hard. Because lithography machines require a lot of precision instruments and have very high requirements for accuracy, they are difficult to produce.

I think the lithography machine is indeed more difficult to produce, and it is more troublesome to produce, so now its ** is relatively high and relatively few.

The production of lithography machine is very difficult, because it is a precision instrument, and every link needs to be very careful.

The lithography machine is through the silicon wafer, so as to clean the surface, dry and apply photoresist, align, teach, transfer and other processes to complete the work; One lithography machine can produce 100 million chips a year.

The working principle of the lithography machine is to clean and dry the surface of the silicon wafer, spin coating photoresist, alignment, degumming, cleaning, transfer and many other processes, a lithography machine can produce 100 million chips a year.

The lithography machine works on silicon wafers, the silicon wafers will be processed, some photoresist will be applied, and then **, a lithography machine can manufacture at least 100 million chips a year.