What is the accuracy of the solder paste thickness gauge?

PCB size: 365 x 860mm

PCB thickness: >5 mm

Object height: 75 mm

Solder paste thickness: 10 1000 um

Scan frame rate: 400 frames per second.

Scan Width: Height Resolution: um

High repeatability: <0 5 um

Volumetric repeatability: <

grr: <8%

Image acquisition resolution: 4 million effective pixels.

Field of view: x mm

Scanning light source: 650nm red laser.

Background light: Red, green, blue LED (three primary colors).

Mark recognition: Support intelligent anti-noise algorithm, can recognize a variety of shapes Mark3D mode: color level, grid, contour simulation map can be rotated at any angle, scale and field of view can be scaled, XYZ three-dimensional scale.

Measurement mode: one-click fully automatic, semi-automatic, manual cross-section analysis.

Measurement results: average height, highest, lowest, area, volume, area ratio, volume ratio, length, width, number of targets, etc., the main results can be exported to an excel file.

SPC statistical functions: average, maximum, minimum, range, standard deviation, CP, K, CPK, etc. XBAR-R Mean Range Control Chart (with Out-of-Gauge Warning Zone), Histogram.

Coordinate collection: Support to collect and export coordinates to excel files.

1. New automatic solder paste testing equipment:

Model: KY-8030-3M

Brand: Keyon

Origin: South Korea.

Market**: $10,000.

Purpose: For inspecting solder paste for components on circuit boards.

Function: Based on the optical principle, it can detect the common problems encountered in welding production.

Measurement accuracy: hail town zhiyuan min travel repeatability

Measurement of the thickness, average value, highest and lowest point of printed solder paste. Area measurement, volume measurement, xy length and width measurement. Truncated surface analysis:

Height, highest point, cross-sectional area, distance measurement. 2D measurement: distance, rectangle, circle, ellipse, length and width, area, etc.

The 1,2D solder paste thickness tester can only measure the height of a certain point on the solder paste, while the 3D thickness gauge can measure the height of the solder paste of the entire pad, which can better reflect the real solder paste thickness. In addition to calculating the height, it is also possible to calculate the area and volume of the solder paste.

2. 2D solder paste thickness tester manual focusing, large human error. The 3D thickness gauge computer autofocuses, and the thickness data measured is more accurate.

The non-contact laser thickness gauge is a linear beam generated by a special laser, which is projected onto the target to be measured (solder paste) at a certain inclination angle, because there is a height difference between the target to be measured and the surrounding substrate, and the laser beam on the observed target and the substrate has a corresponding intermittent drop, as shown in the figure.

1-1. According to the trigonometric relationship, the height difference between the cross-section of the target to be measured and the surrounding substrate can be calculated through the drop spacing, so as to realize non-contact rapid measurement. Product Features:

1 Windows interface, easy to operate;

2. The measured value can be recorded, archived and printed;

3. The measured value is accurate;

4. The focal length can be adjusted according to the thickness of the circuit board;

5 The body is small and flexible, and it is easy to move. Applicable:

1. Measurement and statistical analysis of various thicknesses, widths and lengths;

2. Inspection of quality control of solder paste printing process;

3. Dimensional measurement after solder paste printing and molding;

4. Within the allowable measurement range, it is also applicable to the measurement and inspection of other articles; Features:

1. Measure thickness, length, width, spacing, diameter, angle;

2. Provide a height distribution value;

3. Analysis and control of different solder paste thicknesses;

4. Single-point and multi-point list of measurement results;

5 x-bar chart, range chart;

6 CP, CPK control charts and statistical reports.

Canyon uses the principle of laser projection to project a high-precision red laser (up to 15 microns with an accuracy) onto the surface of the printed solder paste, and uses a high-resolution digital camera to separate the laser profile. Based on the horizontal fluctuation of the profile, the thickness change of the solder paste can be calculated and the thickness distribution of the solder paste can be depicted, and the printing quality of the solder paste can be monitored and defects can be reduced.

Shear velocity d: (negative primary square.

Repeatability: Measuring range:

Measurement accuracy: 5% of indicated value Temperature range: room temperature 5% display logger output:

Viscosity: 1mV pa·s, temperature: 10mV C, number of revolutions accuracy:

2 Encoder Control Features: 1Detailed 3D images can be obtained by taking pictures of the image through laser scanning 2

Multi-color LEDs that can change 16.77 million colors are used, enabling accurate measurement of various substrates 3With the Gerber File transformation program, it is possible to quickly make a check data 4Automatically select 2D 3D 5

SPC analysis is available based on daily measurement data (option).

Print display: viscosity, temperature, shear rate, rotational speed, date, JIS standard (program control, automatic test and print).

Automatic measurement: JIS preparation method (PCU-203 and PCU-205 only, PCU-201 does not have this function).

Power supply: 220V 55Hz 70W

Dimensions: L410 W350 H500mm