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Metal mobility, stable, not easy to react, good conductivity, metallic luster.
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It has the properties of metal and is very stable.
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CopperPhysical propertiesCopper is a purplish-red luster metal with a density of cubic centimeters. Melting point, boiling point 2567. It has good ductility.
Good thermal and electrical conductivity. Therefore, cables and electrical and electronic components are the most commonly used materials, and can also be used as building materials, which can form many alloys.
Chemical properties of copper:
Divalent copper salts are the most common copper compounds, and their hydrated ions are often blue, while chlorine ligands are green, and are azurite and turquoise.
and other mineral colors, which have been widely used as pigments in history. Copper building structures can be corroded to produce patina (basic copper carbonate).
The decorative arts mainly used metallic copper and copper-containing pigments.
The above content reference: Encyclopedia - Copper.
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The chemical formula of copper is Cu.
Copper is a metallic element and a transition element, the chemical symbol Cu, English copper, atomic number 29. Pure copper is a soft metal, the surface is reddish-orange with metallic luster when it is first cut, and the elemental color is purple-red.
Good ductility, high thermal and electrical conductivity, so it is the most commonly used material in cables and electrical and electronic components, and can also be used as a building material, which can form many alloys. Copper alloys have excellent mechanical properties and very low resistivity, the most important of which are bronze and brass. In addition, copper is also a durable metal that can be used many times without compromising its mechanical properties.
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In the case of junior high school and high school, the properties of copper compounds are as follows:
Copper oxide: black solid, insoluble in water, can be dissolved by reaction with acid.
Cuprous oxide: a red solid, insoluble in water, which undergoes disproportionation reaction in non-oxidizing acids to form copper salts and elemental copper.
Copper hydroxide: blue solid, insoluble in water, can be dissolved by reaction with acid.
Anhydrous copper sulfate: white solid, soluble in water, turns blue in water, commonly used in laboratories to test water.
Basic copper carbonate: It is the main component of patina, insoluble in water, and can be dissolved by reaction with acid.
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Copper is a heavy metal element that is not very reactive. It does not react with oxygen in dry air at room temperature. However, when heated, it can be oxidized to form black copper oxide CuO: if it continues to burn at a very high temperature, it will produce red cuprous oxide Cu2O, which is toxic.
Copper is a transition element, the chemical symbol Cu, English copper, atomic number 29.
1.Reaction with air (O2, H2O, CO2): After being left in humid air for a long time, a layer of patina (basic copper carbonate) will slowly form on the surface of copper, which prevents further corrosion of the metal, and its composition is variable.
2.Reaction with halogens: Copper can be combined with chlorine under ignition conditions.
3.Reaction with ferric chloride solution: In the electronics industry, FeCl3 solution is commonly used to etch copper to make printed lines.
4.Reaction with air and dilute acids: In the potentiometric order (metal activity order), the copper group elements are all after hydrogen, so the hydrogen in the dilute acid cannot be replaced. However, when air is present, copper can be oxidized to copper oxide, which then reacts with acids and slowly dissolves in these dilute acids.
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Copper is a heavy metal element that is not very reactive. It does not react with oxygen in dry air at room temperature. But when heated, it can be oxidized to synthesize black copper oxide cuo:
Continued combustion at very high temperatures will produce red cuprous oxide Cu2O, which is toxic and is widely used in ship bottom paints to prevent parasitic plants and animals from growing on the bottom of ships.
In moist air, a layer of green patina slowly forms on the surface of copper, the composition of which is mainly basic copper carbonate
In the potential sequence, copper comes after hydrogen, so copper cannot react with dilute hydrochloric acid or dilute sulfuric acid to release hydrogen. But in air, copper can be slowly dissolved in dilute acids to form copper salts
Copper is easily dissolved by oxidation of oxidizing acids such as nitric acid or hot concentrated sulfuric acid.
At room temperature, copper can be directly combined with halogens, and copper can be directly combined with sulfur to form Cus. when heated
In addition, copper can also interact with ferric chloride. In the radio industry, FeCl3 solution is often used to etch copper to make printed lines.
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