What is the thermal conductivity of epoxy resin? a.k.a. epoxy bakelite board .

Thermal conductivity of epoxy resin refers to the ability of a material to conduct heat per unit thickness at a unit temperature gradient. Epoxy resin is a polymer compound with excellent insulation properties and mechanical properties, which is widely used in electronics, electrical, aerospace and other fields. Epoxy resins have a low thermal conductivity, typically between w (m·k).

Epoxy bakelite board is a composite material made of a mixture of epoxy resin and wood pellets, which has high strength and thermal conductivity. Due to the presence of wood pellets, the thermal conductivity of epoxy bakelite boards is affected, usually between w (m·k).

Epoxy bakelite board has the characteristics of good thermal conductivity and is suitable for some occasions that need heat dissipation. For example, in electronic equipment, due to the work of electronic components, a large amount of heat will be generated, and if the heat cannot be dissipated in time, the temperature of the equipment will be too high, which will affect the normal operation of the equipment. The use of epoxy bakelite board with good thermal conductivity as a heat dissipation material can effectively conduct heat to the surrounding environment and maintain the normal working temperature of the equipment.

In addition, epoxy bakelite board also has excellent insulation properties and corrosion resistance, which can effectively protect electronic components from the external environment. Therefore, in the design and manufacture of electronic equipment, epoxy bakelite board is widely used in the manufacture of heat sinks, heat sinks, heat dissipation modules and other components.

In conclusion, the thermal conductivity of epoxy bakelite board is usually between w (m·k), which has good thermal conductivity and is suitable for occasions where heat dissipation is required. At the same time, it also has excellent insulation properties and corrosion resistance, which can effectively protect the normal operation of electronic components.

General epoxy resin.

The thermal conductivity of the material is around the corner.

550j/(kg·℃)

Due to the chemical activity of the epoxy group, it can be used to open the ring with a variety of compounds containing active hydrogen, solidify and cross-link to form a network structure, so it is a thermosetting resin. Bisphenol A epoxy resin.

Not only is the yield the largest and the most complete variety, but also the new modified varieties are still increasing, and the quality is constantly improving.

The most prominent feature of epoxy resin is its strong adhesion ability, which is the main ingredient of the familiar all-purpose glue Sakura. In addition, epoxy resin is also chemically resistant, heat-resistant, has good electrical insulation properties, and has a smaller shrinkage rate, which is better than phenolic resin.

It has better mechanical properties.

The disadvantage of epoxy resins is weather resistance.

Poor, low impact strength, brittle texture.

Epoxy resin is a general term for a class of polymers that contain more than two epoxy groups in the molecule. The thermal conductivity of epoxy resin excavation is W mk.

Extended Limb Nucleus Profile:

Material properties of epoxy resin:

Epoxy resins have both secondary hydroxyl and epoxy groups, and the secondary hydroxyl group can react with isocyanates. Epoxy resin is directly added to the hydroxyl group of polyurethane adhesive as a polyol, and only the hydroxyl group participates in the reaction using this method, and the epoxy group fails to react. The epoxy is opened with an acidic resin and a carboxyl group, and then reacts with the isocyanate in the polyurethane adhesive.

Epoxy resin can also be dissolved in ethyl acetate, phosphoric acid is added to the heating reaction, and its adduct is added to the polyurethane adhesive; the initial adhesion of the glue; Heat resistance and hydrolytic stability can be improved, and alcohol amines or amines can be reacted to form polyols, and the presence of tertiary nitrogen atoms in the adducts can accelerate the NCO reaction.

The use of epoxy resin as a polyhydroxy component combines the advantages of polyurethane and epoxy resin, and has good adhesion strength and chemical resistance, and the epoxy resin used in the manufacture of polyurethane adhesive generally uses EP-12, EP-13, EP-16 and EP-20 varieties.

Modification method: 1. Select curing agent;

2. Add reactive diluent;

3. Add filler;

4. Add special thermosetting or thermoplastic resin;

5. Improve the epoxy resin itself.

Epoxy resin is a common polymer compound, which is widely used in coatings, composite materials, electronic materials and other fields. Thermal conductivity is a physical quantity that measures the thermal conductivity of a substance, and it is also an important performance index for epoxy resins.

The thermal conductivity of epoxy resin usually fluctuates in the range of w (m k), which means that it is a relatively poor thermal conductive material. Comparatively, other materials such as metals have a much higher thermal conductivity. However, in some specific application scenarios, such as electronic packaging, it is necessary to achieve excellent thermal conductivity while ensuring the chemical stability of epoxy resin, so as to effectively dissipate heat from electronic products and avoid overheating and failure or burnout.

In order to improve the thermal conductivity of epoxy resins, people often use the method of adding thermally conductive fillers. For example, the addition of high thermal conductivity fillers such as alumina can significantly improve the thermal conductivity of epoxy resins, but it can also affect other properties of the material. Therefore, how to improve the thermal conductivity of epoxy resin without damaging its overall performance has always been a popular research direction of Fengxian.

In general, the thermal conductivity of epoxy resins is relatively low, and it is usually necessary to increase it by adding high thermal conductivity fillers. The research and improvement of the thermal conductivity of epoxy resin can provide a broader development space for its application in electronic packaging, aerospace and other fields. <>

Generally, the thermal conductivity of epoxy resin materials is around the limit.

Epoxy resin is an organic compound that contains two or more epoxy groups in the molecule, and their relative molecular mass is not high except for a few individuals.