PCBA can glue process, ask for advice, what do you need to pay attention to in this process?

The PCBA jar glue process is a process that uses glue for fixing and encapsulation during PCBA assembly. Here are a few aspects that need to be paid attention to when carrying out the PCBA jar glue process:

Choose the right glue: Choose the right glue according to the needs of PCBA and the application scenario. Different glues have different properties, such as curing time, adhesion, high temperature resistance, etc. Make sure the glue you choose meets the requirements of the PCBA.

Control the amount of glue: When carrying out the canning process, the amount of glue needs to be controlled to avoid the use of too much or too little glue. Too much glue may cause a short circuit between PCBA components or affect signal transmission, while too little glue may not achieve the effect of fixing and encapsulation.

Precise glue application: When applying glue, you need to ensure that the glue is evenly applied to a specific location in the PCBA. Specialized gluing equipment or manual gluing can be used, but regardless of the method used, uniformity and accuracy of the glue need to be guaranteed.

4.Control curing time and temperature: Glue requires a certain amount of time and temperature during the curing process. According to the requirements of the glue, the curing time and temperature are controlled to ensure that the glue can fully cure and achieve the desired performance.

Quality control and testing: After the PCBA jar glue process, quality control and testing are required to ensure the curing effect of the glue and the quality of the PCBA. Visual inspection, glue adhesion test, glue curing performance test, etc. can be performed.

6.Environmental and safety precautions: Environmental and safety issues need to be paid attention to when carrying out the canning process. Ensure that the operating environment is dry and clean, and take necessary safety measures, such as wearing gloves, goggles, etc.

1) Choose a suitable glue: Silicone and epoxy potting adhesives are commonly used, at least understand the parameters of "operation window time" and "curing time".

2) Design appropriate molds and fixtures, and don't let the glue flow to other places.

3) According to the characteristics of glue, manual or automatic glue filling: control the amount of glue.

4) Leave it untouched until it has enough curing time to remove the mold.

The names of the machines that operate in the electronics factory, and the names of the departments.

PCBA selects the solder paste process when the single-sided or double-sided SMT does not require wave soldering, and the red glue process is selected when the SMT surface is on the same side as the plug-in soldering surface.

The differences between the reflow soldering red glue process and the solder paste process are as follows:

1. Red glue plays a fixed role and will not conduct electricity, and solder paste also plays a fixed role, but it will have a conductive effect;

2. Red glue needs to be soldered by wave soldering.

3. The temperature of red glue over wave soldering is lower than that of solder paste over wave soldering.

4. Red glue is generally used as an auxiliary material, generally used for fixing, because solder paste can conduct electricity, so it is often used when soldering.

The functions of the reflow soldering red glue + solder paste dual process are as follows:

In the mixed process of reflow soldering red glue process and solder paste process, in order to avoid the situation of reflow once on one side and one wave wave, the components on the wave soldering surface of the PCB should be put on red glue, and the solder paste printing process should be added once during wave soldering.

One brushes red glue, one brushes solder paste, red glue plays a fixed auxiliary role, red glue does not conduct, solder paste conducts, solder paste is the real soldering effect, red glue solders solder paste during wave soldering.

Single- or double-sided SMT products that do not require over-wave soldering use an all-solder paste process. Single-sided SMT and SMD plug-in (non-SMD surface is plug-in soldering surface) products use solder paste process on the SMT surface, and wave soldering is used on the plug-in surface. When the patch surface and the plug-in welding surface are on the same side, the patch uses the red glue process.

Summary: In most cases, the red glue process is only done when the patch surface needs to be wave soldered.

Exception: Sometimes red glue is also used in the solder paste process. If some of the socket seats are soldered with solder paste alone, there will be an offset during reflow, so pre-dot glue on the base or PCB to help fix it.

If you don't understand, please ask.

1.Workers must wear protective gear.

2.Conformal coatings that have not been used up after spraying are cleaned by turning the can upside down and pressing the nozzle knob until only gas is ejected after spraying.

3.If you want a thicker coating, it's best to do so by applying two thinner coats – and the requirement is that the first layer must be completely dried before the second coat can be applied.

4.When applying paint to the PCB, it is recommended to use tear-off solder mask to cover the PCB.

5.Thickness of the film: The thickness of the film depends on the application method. The amount of thinner is large, the viscosity of the glue is low, and the thickness of the glue is thin; On the contrary, the viscosity of the glue is high, and the thickness of the glue is thick.

6.All coating operations should be carried out under conditions of not less than 16 and a relative humidity of less than 75%. PCBs absorb moisture as composite materials. If it does not go to moisture, the conformal coating can not fully play a protective role. Pre-drying, vacuum drying removes most of the moisture.

Conformal coating: Conformal coating is a specially formulated coating used to protect circuit boards and their related equipment from the environment. Conformal coating has good high and low temperature resistance; After curing, it becomes a transparent protective film, which has superior insulation, moisture-proof, leakage-proof, shock-proof, dust-proof, anti-corrosion, anti-aging, corona resistance and other properties.

Clean PCB board, good ESD control, temperature and humidity control, process control, good selection of resin, relatively perfect production process, targeted selective coating

Fourth, there are many professional forums and knowledge platforms on the Internet, and there are also a lot of information on them, and I always go to the forum to seek solutions to professional problems.

Fifth, ask your questions more carefully and clearly! It's easier for people to understand what it means!

Thanks for taking my suggestion!