Huawei announced a multi chip superposition patent, and the United States completely miscalculated!

It cannot be said that the spring of China's chips is coming, but it can only be said that in the short term, the restrictions on Chinese chips by European and American countries will be greatly weakened.

The development of Chinese chips is being carried out in an orderly manner, but for the current status quo, European and American countries are unwilling to see it. What European and American countries prefer to see is that China's chip industry chain is severely restricted. can only rely solely on foreign imports to meet the demand for domestic chips, so China's chip industry chain is fully blocked.

Huawei has published a number of chip research patents, and among all chip research patents. Huawei's multi-chip superposition patent is a very important scientific research technology. It can be seen from this that the calculation of the United States has failed.

The chip superposition technology invented by Huayu Company can break through the current technological fortress to a large extent and truly achieve the goal of overtaking in corners. But personally, Huawei's chips are really powerful. However, there are still great difficulties in achieving breakthroughs in some aspects.

Although China's chips are constantly improving, and Huawei has also announced the latest research on superimposed chip technology. But it can't be attributed to China's chips, which will usher in spring, such a statement is not rigorous and unreasonable. It is a fact that Chinese chips have always been restricted.

The research of chips is very different from other technological breakthroughs, and it is difficult to truly achieve breakthroughs in some aspects. <>

Although China's chips are restricted, they have been suppressed and sanctioned to a large extent. But we can't just give up, because we are a country with a large population. Every year, a large number of chips need to be imported to European and American countries, and if the chip field is sanctioned, the impact of making orders is very serious.

Therefore, we cannot give up the research on chips, and in the current predicament, we should meet the difficulties. <>

That must be coming, I know that Chinese chips must have such a day, and foreigners must be rampant for a long time.

I think China's chips are getting better and better, the technology is becoming more and more advanced, and it also occupies a certain position in the world, which is also our gospel and makes us feel more fulfilled.

According to the information of the State Intellectual Property Office, today, Huawei Technologies ****Patents for "Chip Stacking Package Structure and Packaging Method, Electronic Devices" were publishedwith publication number CN114450786A.

The patent abstract shows that the application relates to the field of electronic technologyIt is used to solve the problem of how to reliably bond multiple sub-chip stacking units to the same main chip stacking unit

According to the patent documents, the chip-stacked package structure includes matching:

a main chip stacking unit with a plurality of main pipe feet located on the first surface insulated and spaced at intervals;

the first bonding layer, disposed on the first surface; The first bonding layer comprises a plurality of bonding components that are insulated and spaced at intervals;

Each of the plurality of bonding components consists of at least one bonding section, and any two Sepai bonding sections are insulated and the cross-sectional area of any two bonding sections is the same; A plurality of bonding components are bonded to a plurality of Peihuikai main pins;

a plurality of sub-chip stacking units arranged on the surface of the first bonding layer away from the side of the main chip stacking unit;

The sub-chip stacking unit has multiple micro-bumps that are insulated and spaced at intervals; Each of the multiple microbumps is bonded to one of the multiple bonding components.

Huawei's new patent has sparked heated discussions in various countries

According to reports, Huawei announced that it has successfully won a patent for graphene transistors, which also involves the field of semiconductors, and the emergence of these technologies marks a new stage in China's chip research.

Graphene transistors play a vital role in the development of graphene chips, which can increase the speed of electron transmission while effectively increasing the output resistance of chip components and devices, thereby maximizing RF performance. And the unique structure of the graphene chip can make the engraving present a three-dimensional style, which also greatly increases the performance of the chip, and now Huawei has announced that the patent application for this technology has been successful, which is undoubtedly a new beginning for domestic chips.

Graphene chips are significant

The emergence of graphene chips is likely to completely promote China's further development of semiconductor chips, and this technology is mastered by China, and it will also become a "major **" in the scientific and technological showdown between China and the United States. You must know that the most common traditional chips on the market follow a law - Moore's Law, as early as after the development of semiconductor chips, the engineers who developed the chips once predicted that every 18-24 months after the state high school, the number of components that can be accommodated on the integrated circuit will be doubled, and the performance will be doubled.

This prediction is like a curse for traditional chips, which means that when the number of components that can be accommodated on an integrated circuit reaches a certain value, it is difficult for traditional chips to have a future of development. The subsequent discovery of graphene crystals has provided a new way of thinking, but the process of turning the idea into reality is very difficult, and the United States has not yet cracked this technology.

Semiconductor chips will usher in reform

In addition to China's graphene technology, in May 2020, the Peking University team created a carbon nanotube array with high purity, which operates faster and consumes less energy than foreign countries, reducing energy consumption by 30% in comparison. It is reported that because of its excellent performance, carbon nanotube arrays can be applied in more fields, not only in artificial intelligence, satellite positioning and other aspects, but also in medical equipment, national defense science and technology also have great use.

Some experts ** this carbon nanotube array with higher carrier mobility and stability is likely to replace traditional silicon wafers, and the emergence of graphene materials has paved the way for Chinese chips, and China is bound to become a leader in this field.

Although there is still an insurmountable gap between China and the United States in the chip technology manufacturing industry, China's chip R&D technology has always been among the best. It is believed that with more and more technological breakthroughs, China will also make progress in the chip manufacturing industry, and China will establish its own chip industry chain at that time, and the United States will no longer be able to use the same means to restrict China.

Recently, Huawei disclosed a new patent. The patent is published by Huawei Technologies, the patent is called "chip, chip manufacturing method and electronic equipment", and the patent number is CN113113367A.

However, this patent is not the core architecture, etc., but it is also crucial for chips. According to the patent abstract of Qichacha, the patent belongs to the field of chip heat dissipation finch stove technology. Including a shell, a plurality of silicon wafers and a plurality of thermal conductive sheets, the thermal conductive wafers and the silicon wafers are in the same shell, the principle is that by installing the thermal conductive wafers between the adjacent two silicon wafers, the amount of heat on the silicon wafers can be conducted to the thermal dismantling wafers, the temperature on the silicon wafers can be reduced, and the heat dissipation capacity of the chips can be improved, so as to avoid the situation that a large amount of heat accumulates on the silicon wafers and the chips burn out.

In other words, the patent may be a multi-layer packaging technology for chips, where the multi-layer semiconductors are cooled by a thermally conductive sheet, and both the semiconductor and the thermally conductive sheet are encapsulated in a single shell.