What should I do if the solder is attached to the tin plate? How to solve the problem of soldering w

That depends on the circumstances. Solder sticking tin plates in my work experience. One.

It depends on whether the hole of the tin plate is a cylindrical eyelet. Some of the holes of the tin plate are conical holes, and the solder sticking tin plate is normal. Two.

Look at whether there is a lot of tin when planting tin. Or if you use a scraper to scrape the tin flat. If there is a lot of tin or it is not scraped flat, it is easy to describe the solder balls on the tin planting plate when it is heated.

If the solder ball has a large eyehole, it must be sticking to the tin plate. Three. If the tin plate and solder paste are fine, you can also use spot soldering treasure when heating.

1.Temperature characteristics.

The melting point of pure tin is 232 degrees Celsius, the melting point of pure lead is 327 degrees Celsius, and the melting point temperature of tin-lead alloys depends on the ratio of the two metals, as shown in the figure. The melting point of the most common solders used for soldering electronic or electrical devices is much lower than the respective melting point temperature of tin or lead.

When the solder with a ratio of 60 to 40 reaches a soldering temperature of 250 and melts, it cools down slowly, and it remains liquid until 188 and solidifies at 183. Between 188 and 183, the solder goes through two states: glued and viscous. As the solder cools to a sticky state, the solder appears in a progressively increasing proportion of solid particles suspended in the residual liquid state.

63 37 proportional solder without sticking. When the 63 37 ratio solder is slowly cooled from 250 soldering temperature, it cures immediately when it reaches 183. The solder alloy in the non-adhesive area is called fusible solder.

As the solder cools, it needs to be well stabilized until it is fully cured. If the solder is moved during the solidification process, additional pressure is applied to the solder, which can cause undesirable cracks (cracks) in the solder joints. The solder must be allowed to cool naturally, and the rate at which it cools affects the lattice structure of the solder.

Be careful not to blow on the solder while it is cooling.

2.Solder selection.

Filamentous solder is the most common, but there are also solders in the form of mud, ingots, and specific shapes. Solder putty is often used for the welding of cans, tubular and SMD components.

When selecting solder wire, it is necessary to select the size (specification) of the solder wire that meets the requirements of the work. Thicker solder wires provide too much tin for small solder joints and will flood the solder joints; The thin solder wire makes the solder wire foot easy to control. The following is a guide to the selection of a reference:

1) The diameter is or 10mm solder wire: used for electronic or electrical soldering.

2) The diameter is or 07mm solder wire: used for soldering ultra-small electronic components.

3.Security.

Solder is made up of metals that are never allowed to be brought into the human body and are harmful to human health. Therefore, it is essential to wash your hands before eating and drinking water after welding. Solder mud is composed of very fine solder particles, which is more harmful to the human body. Therefore, the solder mud that sticks to the ** must be cleaned immediately.

4.Safety of welding.

Welding is carried out at a temperature that can cause combustion, so the following 5 points must be noted:

1) Wear protective glasses when welding.

2) Carefully place the hot soldering iron to be used on the stand each time.

3) The solder on the copper head should be wiped on a wet sponge and never tossed around.

4) Replace the hot copper head very carefully.

5) Smoking during welding will cause phosgene to be formed in the lungs, including meson gas, which is very harmful to the human body. Therefore, you should never smoke while welding.

Then polish and clean the pins of the integrated circuit to be welded with fine sandpaper, evenly tin, and then align the pins of the integrated circuit to be welded with the corresponding solder joints of the printed board, and gently press the ,.. on the surface of the integrated circuit by hand during solderingIn order to compensate for the change in the coplanarity of the leads and to prevent gaps, the wicking effect of the leads can be solved by slowing down the heating rate and allowing the bottom surface to heat more than the top surface, in addition to ,..

The copper wire is heated after soldering. File off a thin layer of metal oxide wrapped inside the sonotrode head.

The new copper inside the sonotrode is exposed, and the sonotrode is coated with some rosin while the thermonuclear age is being sold.

When the sonotrode reaches the temperature of melting the wire, the entire sonotrode is coated with a layer of tin, so that the sonotrode is easy to eat tin. Remember to use the lowest temperature setting. The temperature is 100-200, and the spring deficiency is not more than 200.

Remember, when you heat the welding head in alcohol, do not soak the heated part. Extended Information: Notes:

1.Try to use low-temperature welding: high temperature will accelerate the oxidation of the sonotrode and reduce the life of the sonotrod.

If the sonotrode temperature exceeds 470, the oxidation rate is twice that of 380. 2.Don't put too much pressure :

When welding, do not apply too much pressure, otherwise the sonotrod will be damaged and deformed. As long as the sonotrode has sufficient contact with the solder joint, the heat can be transferred. In addition, choosing the right sonotrode also helps with heat transfer.

3.Be sure to leave the tin on the sonotrode: this reduces the chance of oxidation of the sonotrode and makes the sonotrode more durable.

After use, new solder should be added after the temperature of the sonotrode is slightly reduced, so that the tin plating layer has a better antioxidation effect. 4.Keep the sonotrode clean and remove oxides immediately.

If there is black oxide on the sonotrode, the sonotrode may not be covered with tin and must therefore be cleaned immediately. When cleaning, first adjust the temperature of the sonotrode to about 250, then clean the sonotrode with a cleaning sponge, and then apply tin. Repeat until the oxide is removed.

There is a reason why the liquid stove does not stick to the tin when soldering electronic products

1: It is oxidized by the soldering product, so the general soldering product cannot be soldered, and it needs to be buried with tin oxide water 128a soldering.

2: The soldered electronic product itself is a problem, such as material and other reasons.

3: Choose the right welding material.

This is caused by insufficient temperatureIt is best to adjust the temperature of the soldering iron to about 280 degrees, put the soldering iron tip on a damp sponge or steel wool ball and wipe it repeatedly. Or turn off the power supply of the soldering iron, polish off the dirt and oxide on the tinning surface of the soldering iron tip with a blade or fine sandpaper, and then put the soldering iron tip into rosin or rosin paste;

Turn on the power supply of the soldering iron, adjust the temperature to about 280 degrees, let the soldering iron tip heat in the rosin, and then use the solder wire to tin the soldering iron head, find a copper wire or soldering wire after the tin, and let the soldering iron tip rub repeatedly on the copper wire until the solder is full of the entire soldering iron.

1. Gently scrape with a wallpaper knife to see a layer of white.

2. Plug in the electricity, dip in rosin, add solder when it's hot, be sure to eat more tin, and dip it in rosin.

3. The soldering iron must have tin when it is not in use, or it is not easy to burn to death.

Possible causes and solutions for not sticking to solder during soldering.

Possible reasons why the tin does not stick when soldering:1Oxidation of the surface of the contact surface 2The surface of the contact surface is dirty.

If the contact surface is oxidized, you can use a sharp object, such as tweezers or a knife, to scrape the contact surface lightly to remove the surface oxide. This is a common practice used by maintenance personnel.

If it is dirty, use an electrostatic brush to clean the messy surface of the contact surface.

Let the welding surface be free of foreign matter and oxidation, and then start welding. Cavity imitation.

Flux paste can be added to remove oxidation on the contact surface, reduce surface tension and improve wettability.

You can also try a high-power soldering iron.

Increase the welding temperature.

In the actual maintenance of the factory, when the welding is difficult, generally two people work, one person uses a heat gun to assist heating, and the other person adds tin for welding.

There is also an industrial induction cooker, which can put the circuit board on the induction cooker and preheat the board, which can also improve the solderability.

Tin plate is a metal material that uses electrochemical methods to coat a metal surface with a tin layer. The following is the production process of the tin plate:

Prepare the substrate: choose a metal substrate suitable for tin planting, such as copper plate, iron plate, etc.

Cleaning the substrate: The substrate is degreased, rusted, cleaned and other treatments to ensure that the surface is clean.

Tin planting: Put the cleaned base chain waste into the tin planting tank, and place the electrolyte containing tin ions in the tank. Under the action of the electrode, the tin ions are reduced to metal tin, which is deposited on the surface of the substrate to form a tin layer.

In the process of tin planting, it is necessary to control parameters such as current, temperature, pH value and so on to ensure the uniformity and quality of the tin layer.

Cleaning: The tin panels are cleaned to remove residual electrolytes and contaminants.

Drying: The washed panels are dried to remove moisture.

Inspection: inspect the plate after tin planting, including appearance, thickness, adhesion, corrosion resistance and other indicators.

Packaging: Pack the bottin sheets that meet the requirements for transportation and storage.

The above is the production process of the tin board, and the tin planting process is the most critical link in the whole production process, and it is necessary to strictly control the parameters to obtain high-quality tin board.

The production principle of tin plate is very simple, and the hot-dip tin process is generally used. The production steps are as follows: first the material is coated, then the tinned tin wire mesh is placed on the surface of the transceiver, and finally Huaisun Jue uses a hot tin machine Kaina to plate the solder paste and tin lead wire mesh onto the transceiver plate, so that it has good oxidation resistance and rust resistance.

The process of producing tin plates requires that the raw materials be processed and formed first, and then a layer of tin metal is plated on the bright plate. Finally, the tin planting components are baked in an environment with a consistent temperature to complete the tin planting process. The process of producing a tin sheet requires the raw material to be formed and then coated with a layer of tin metal on the pattern.

Finally, the tin planting components are baked in an environment with a consistent temperature to complete the tin planting process.

Summary. Hello, kiss is honored to answer for you: the contact surface is oxidized, and you can use a sharp object, such as tweezers or a knife, to slightly scrape the contact surface surface to remove the surface oxide.

This is a common practice used by maintenance personnel. If it is dirty, clean the contact surface with an electrostatic brush. Try adding solder.

Hello, kiss is honored to answer for you: contact surface surface oxidation, finger can be used with a sharper object, such as tweezers or a knife to slightly scrape the surface of the contact surface, remove surface oxide. This is a common practice used by maintenance personnel.

If it is dirty, clean the contact surface with an electrostatic brush. Try adding solder.

Related information: Flux paste can be added to remove oxidation on the surface of the contact surface, reduce the surface tension, and improve wettability. 3 3 You can also increase the soldering temperature appropriately, and the use of a soldering iron with high round rock power is also a method of orange royal.