PROTEL CABLING ISSUES.

This line is OK, first of all, you reasonably distribute the components, such as the 1234 feet of U1 and the 5678 feet of U2 are connected, you will be close to the feet of these two ICs, the line is as straight as possible, the place where the bend must be used at a 45 degree angle, do not turn 90 degrees, ** After the road is through, the line will be poured copper, pay special attention here, press the O + P shortcut key to pop up the dialog box, Option automatically remov do not hook in front of the hook, the hook is automatic It is not good to pour copper on the separate linePlease note this when the copper pour on the entire circuit board is automatically remov in front of the hook.

P+G is used for copper pouring, and then connect to select the network after it, GND for the whole copper pour, and the network of the current line for copper pouring for a single wire. The following two boxes are also checked. The grid and line weights in the plane settings are set to the primary front hook.

You can refer to the board I draw.

I'm talking about the settings of protel99se, I hope it can help you!

This can be traced with a line (the thickness of the line can be mastered by yourself), but to achieve this effect, a rule must be ticked in the wiring rules. Hehe.

It's copper, could someone deliberately draw it like this with a line?

1 Automatic wiring is not recommended, as it is troublesome and time-consuming.

2 You have two circuit boards inside a PCB document.

Inner shape, lower left capacity.

There is a network connection between the corner and the board in the upper right corner, and your success rate has actually become negative, and here's why. It is recommended that you copy one to another PCB file and then delete a board outline from this document, so that the autoroute success rate will not become negative.

3 What can't be deleted by white is the network flying line, and delete will not be deleted and should not be deleted.

4 Red and blue are the top and bottom wiring, your single-panel settings are not set up, you should remove one layer at the allowed trace layer, so that the auto routing is only on the first layer.

5 It is still not recommended to auto-wiring, it is troublesome to modify, the PCB performance is not good, and it may not be able to achieve the goal.

If the automatic wiring can't go, it will appear, and the line will be messy, and it should be gone when refreshed.

x,y is the mirror, the meaning of the mirror is to see the yuan zhi parts of the du in the computer are the front of the component, once the mirror dao

You can see the back of the original, so the original welded on the back side must be mirrored, and the components of the front plug-in are a bit problematic.

The electrical properties are unchanged, 1 pin or 1 pin, but there is a problem when welding, and it doesn't matter if the two pins are symmetrical and directionless.

This is the pad of the patch, the distance of the pad cannot be changed, it must be consistent with the real thing.

It's just that this distance is larger than the set safe distance, so it shows green.

Press the D+R key to pop up a setting option box, as shown below, double-click the blue bar below to change the default 10 mil to a smaller one.

As for the component coordinates of the PCB, they are all 1 pin, which is the default, and it is customary to do this, which is more convenient.

To set the center of the component as the coordinate, you need to go to the footprint library of the PCB component and modify it.

Power cord VCC, GND, modified will be connected to other wires, power cord VCC, GND is best to be thickened by hand, the principle of wiring is as follows:

1) The wires used at the input and output terminals should be avoided as close to each other as possible. It is best to add ground wires between wires to avoid feedback coupling.

2) The minimum width of the printed board wire is mainly determined by the adhesion strength between the wire and the insulating substrate and the current value flowing through them. When the thickness of the copper foil is 1 15mm in width, the temperature will not be higher than 3 through a current of 2A. Therefore, the wire width is sufficient.

For integrated circuits, especially digital circuits, wire widths are usually chosen. Of course, whenever possible, use as wide wires as possible, especially power and ground wires. The minimum spacing of the conductors is primarily determined by the inter-wire insulation resistance and breakdown voltage in the worst-case scenario.

For integrated circuits, especially digital circuits, as long as the process allows, the pitch can be less than 5 8mil

3) The bend of the printed wire is generally arc-shaped, and the right angle or angle will affect the electrical performance in the high-frequency circuit. In addition, try to avoid using large-area copper foil, otherwise, when heated for a long time, the copper foil is prone to expand and fall off. When it is necessary to use a large area of copper foil, it is best to use a grid.

This helps to eliminate volatile gases generated by heating the adhesive between the copper foil and the substrate.

1.The layout is from large to small, and the placement of components is difficult and then easy. Put the original parts that take up a lot of space first, and then put the simple components.

2.Arrange the overall sequence based on the schematic diagram and the flow direction of the circuit signals.

3.The signal line should be as short as possible, and the main signal should be the shortest.

4.It is necessary to separate high-frequency and low-frequency, high-voltage and low-voltage, high-current, small-current, analog and digital.

5.The same components of the power supply can be placed together, and the modules of the same structure can be placed symmetrically.

6.Considering the overall heat dissipation, put the interface around the board, and consider the stability of the center of gravity and the overall appearance.

If you don't understand, you can ask me again.

The first one: the part that needs to be set before autorouting: a:

Make sure your schematic is correct; b: Make sure that the components in your schematic are properly packaged; c: The network list is generated correctly; d：

The layout of the environmental parameters of the PCB board is reasonable, such as wiring rules; e: Adjust the layout position of the components appropriately; Make sure it's 100% available.

The second one: the teardrops are to strengthen the adhesion of the pads and the stability of the circuit.

The third: copper plattering, which is also said to be copper pouring, the most common is laying ground wires, and multi-layer boards are also laying power lines. Generally, in order to enhance the anti-interference ability, for example, the ground wire filler area is applied to the electrical signal board layer to reduce interference.

And generally before the copper pouring, the interval between the copper pour-laying area and the signal line should be set to ensure the insulation of the unrelated line.

1: Generally, you don't need automatic wiring, if you want to automatically wiring, set the rules first, such as how wide the power cord is, how big the safety distance is, etc.

2: The advantage of teardrops is that the pad or via can withstand the impact of large changing currents.

3: The advantage of copper pouring is that the board can be well grounded, form a good EMC environment, and enhance the anti-interference ability of the board.

Before automatic wiring, first of all, important signal lines such as power supply should be pre-wired, and then locked protection, before wiring, the wiring width of different networks should be set, spacing, scattering mode, short circuit rules, corners, stacking, etc., and then the wiring should be removed after complete wiring, and manually modified.

Teardrop filling can make the pad and line better connection strength, and the signal is more optimized.

1-1 packaging is to encapsulate integrated circuits, and the word "packaging" itself does not need to be explained, right?

1-2 Double-layer board is a double-layer board, and the word "double-layer" itself does not need to be explained, right?

What functional modules does 2-1DXP include? Everything that should be included is included, such as schematics, PCB diagrams, libraries, 、..However, the person who asked the question is also easy to understand wrongly!

2-2 steps? Draw the schematic diagram first, and then draw the PCB, and if you don't have to draw 2-3 more in the library, you really haven't counted, for example, the number of files is not the same as whether you do electrical inspection, and only the PCB and the program are not the same.