What is a wafer What is a wafer?

Wafers are the basic raw materials for making ICs.

Silicon is refined from sand, and the wafer is purified by silicon elements (, and then these pure silicon are made into silicon crystal rods, which become the material for the manufacture of quartz semiconductors for integrated circuits, and after photographic plate making, grinding, polishing, slicing and other procedures, the polysilicon is melted and pulled out of monocrystalline silicon crystal rods, and then cut into thin wafers. We will hear about a few inches of wafer fab, if the diameter of the silicon wafer is larger, it means that the fab has better technology. In addition, scaling technology can reduce the size of transistors and wires, both of which can produce more silicon dies on a single wafer, improving quality and reducing costs.

Therefore, this means that among the 6-inch, 8-inch, and 12-inch wafers, the 12-inch wafer has a higher production capacity. Of course, in the process of wafer production, yield is a very important condition.

Wafer refers to the silicon wafer used in the production of silicon semiconductor integrated circuit, which is called wafer because of its round shape; It can be processed into various circuit component structures on silicon wafers, and become IC products with specific electrical functions. The raw material of the wafer is silicon, and the surface of the earth's crust is useful for an inexhaustible supply of silica. The silica ore is refined in an electric arc furnace, chlorinated with hydrochloric acid, and distilled to produce high-purity polysilicon, which is as pure as possible.

The wafer fab then melts the polycrystalline silicon, which is then mixed with a small silicon crystal seed in the melt and then slowly pulled out to form a cylindrical monocrystalline silicon rod, a process called "crystal growth" because the silicon rod is gradually formed from a small grain in a molten state of silicon raw material. After the silicon crystal rod is then grinded, polished, and sliced, it becomes the basic raw material of the integrated circuit factory - silicon wafer wafer, which is the "wafer".

The wafer is monocrystalline silicon, which is cylindrical and then sheets into thin slices in the shape of a pie. Through photolithography, many electronic integrated circuits are etched on them, then cut, and then packaged into integrated blocks.

Wafer refers to the silicon chip used in the production of silicon semiconductor integrated circuits, which is called a wafer because of its round shape.

Wafer Profile. Wafer is the carrier used in the production of integrated circuits, and generally wafers mostly refer to monocrystalline silicon wafers. Wafers are the most commonly used semiconductor materials, and are divided into 4-inch, 5-inch, 6-inch, 8-inch and other specifications according to their diameter, and recently developed 12-inch and even larger specifications.

The larger the wafer, the more ICs can be produced on the same wafer, which can reduce costs; However, the requirements for material technology and production technology are higher, such as uniformity and so on. It is generally believed that the larger the diameter of the silicon wafer, the better the technology of the fab, and the yield rate is a very important condition in the process of wafer production.

Basic raw materials. Silicon is refined from quartz sand, and the wafer is purified by silicon elements (, and then some pure silicon is made into silicon crystal rods to become the material for quartz semiconductors for manufacturing integrated circuits, and after photographic plate making, grinding, polishing, slicing and other procedures, the polycrystalline silicon is melted and pulled out of monocrystalline silicon crystal rods, and then cut into thin wafers.

Wafers are the carriers used in the production of integrated circuits.

Wafer refers to the silicon chip used in the production of silicon semiconductor integrated circuits, and is the carrier used in the production of integrated circuits (ICs). The more common silicon chips we see in reality are computer CPUs and mobile phone chips.

In the semiconductor industry, especially in the field of integrated circuits, wafers can be seen everywhere. A wafer is a thin, round high-purity silicon wafer, on which various circuit components can be processed and fabricated, making it an IC product with specific electrical functions.

Wafer Fabrication Process:

Surface cleaning: The wafer surface is covered with a protective layer of about 2um of Al2O3 and glycerol mixture, which must be chemically etched and cleaned before fabrication.

Primary oxidation: SiO2 buffer layer is generated by thermal oxidation method, which is used to reduce the stress oxidation technology of Si3N4 on the wafer in the follow-up.

Thermal CVD: This method has high productivity and good trapezoidal lamination (no matter how uneven it is, the surface in the deep hole also reacts, and the gas can reach the surface and adhere to the film), so it is extremely versatile.

The above content reference: Encyclopedia - Wafer.

A wafer is a silicon wafer used to make a silicon semiconductor circuit, and its raw material is silicon. The high-purity polysilicon is dissolved, incorporated into the silicon crystal seed, and then slowly pulled out to form a cylindrical monocrystalline silicon. After grinding, polishing, and slicing, silicon wafers are formed, that is, wafers.

The domestic wafer production line is mainly 8-inch and 12-inch.

The main processing methods of wafers are wafer processing and batch processing, that is, processing one or more wafers at the same time. As semiconductor features become smaller and smaller, processing and measurement equipment become more and more advanced, resulting in new data characteristics for wafer processing. At the same time, the decrease in feature size increases the influence of the number of particles in the air on the quality and reliability of the wafer after wafer processing, and with the improvement of cleanliness, the number of particles also has new data characteristics.

Performance parameters. Silicon wafers and silicon solar cells are typical representatives of semiconductor materials and semiconductor devices, respectively. Semiconductor characterization parameters measure and characterize the performance of materials and their devices.

Since the carriers are the functional carriers of semiconductor materials and devices, the carriers move to form current and electric fields, and the carriers have the characteristics of luminescence and thermal radiation, so the carrier parameters are the basis for characterizing the carrier transport characteristics of semiconductor materials and devices, that is, the carrier parameters are an important part of the characteristic parameters of silicon wafers and silicon solar cells.

When the silicon wafer is processed and manufactured to form a silicon solar cell, due to the difference between the PN junction and the Fermi energy level, the carriers are separated to form a voltage, and then the electrical performance parameters such as saturation current, fill factor and photoelectric conversion efficiency are directly reflected and affect the volt-ampere characteristics of the solar cell. In summary, the main characteristic parameters of silicon wafers include carrier parameters.

Carriers are divided into majority carriers and minority carriers, including electrons and holes. Carrier diffusion and drift form the basis of the current that forms the basis for the transmission of information in semiconductor devices. Carrier transport parameters are the basic parameters to describe the movement and concentration of carriers, including carrier lifetime, diffusion coefficient and recombination rates of the front and rear surfaces.

These parameters directly reflect the physical properties and electrical properties of semiconductor materials, and affect the carrier concentration and mobility. Doping concentration is another important parameter that determines the carrier concentration, which affects the resistivity of the material and the carrier lifetime, and determines the performance of the device.

Wafers are silicon wafers used in the fabrication of circuits. Because its shape is round, it is called wafer, which can be processed into various circuit component structures on silicon wafers, and become integrated circuit products with specific electrical functions, and the main raw material of semiconductor integrated circuits is silicon, so it corresponds to silicon wafers.

The process of the waferPrimary oxidation, SiO2 buffer layer is generated by thermal oxidation, which is used to reduce the stress oxidation technology of Si3N4 on the wafer in the follow-up, thermal CVD, this method has high productivity, good trapezoidal lamination (no matter how uneven it is, the surface in the deep hole also reacts, and the gas can reach the surface and adhere to the film), so it is extremely versatile.

Silicon is widely present in rocks and gravel in the form of silicate or silica in nature, and the manufacturing of silicon wafers can be summarized into three basic steps, silicon refining and purification, monocrystalline silicon growth, wafer molding, manufacturing process, surface cleaning, and about 2um of Al2O3 and glycerol mixed liquid protective layer attached to the wafer surface, which must be chemically etched and surface cleaned before production.

Wafer is one of the industry terms in the microelectronics industry.

High-purity silicon (purity, 9-11 nines after the decimal point) is typically made into a cylindrical bar with a diameter of 6 inches, 8 inches, or 12 inches.

Integrated circuit manufacturers use lasers to cut these silicon rods into extremely thin mountain silicon wafers (round), and then use light teasing and chemical etching methods to make electrical disturbance circuits and electronic components, and after completion, there are a large number of semiconductor chips on each silicon wafer (if there are small-scale circuits or transistors, there can be 3000-5000 pieces on each piece), and these processed round silicon wafers are wafers.

After that, they will be sent to the semiconductor packaging factory for packaging, and then the finished product will be what we see as plastic integrated circuits or transistors.