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The Dimensity 1000 processor is MediaTek's flagship processor that hits the high-end market, with performance between the Snapdragon 855 processor and the Snapdragon 865 processor.
The Dimensity 1000 is a flagship 5G chip launched by MediaTek in 2019. This chip is manufactured using the 7nm process, using the A77+A55 CPU processor architecture, with 4 A77 large core frequencies and 4 A55 small core frequencies. At the same time, in the GPU part, G77MP9 is used, that is, there are 9 G77 GPU cores.
In addition to the processor and GPU, the Dimensity 1000 also uses the third-generation APU, which is what MediaTek said, consisting of two large, three small and one micro with a total of 6 cores.
In terms of performance, the Dimensity 1000 claimed to be the most power-efficient 5G chip at the time of its launch, and it is also the first chip in the world to support 5G dual SIM dual standby, and the Dimensity 1000 is the first chip to support 5G dual-carrier aggregation, with the fastest 5G network speed, which can reach the rate in the downlink 4*4 mode and the rate in the uplink 2*2 mode.
Detailed explanations in many aspects
1. CPU
Snapdragon 865 uses the Kryo 585 architecture of the A77 magic change, and the highest frequency has been reached, while Huawei's Kirin 990 5G uses the A76 architecture of the previous generation, and it is relatively easy to win the Kirin 990.
Dimensity 1000 adopts a quad-core A77 + quad-core A55 architecture, of which A77 cores are both, but the A77 frequency of Snapdragon 865 is higher.
2. GPU.
The Snapdragon 865's self-developed Adreno 650 has strong performance, a good energy consumption ratio, and a relatively small core area. The Dimensity 1000 uses the Arm Mali G77 architecture, which has a somewhat worse performance and core area than the Adreno 650.
3. ISP, DSP, and memory.
In terms of ISP, DSP, memory support and 5G baseband, Snapdragon 865 still has an overwhelming advantage over the Dimensity 1000, but the Dimensity 1000 is an integrated 5G baseband, with advantages in core area and integration, so it also brings a lower **.
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If you don't say Tianji 1000+, that is, an ordinary Tianji, it should be similar to Snapdragon's 845 and 855. It's somewhere in between.
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The Dimensity 1000plus surpasses the Snapdragon 855plus, and its positioning is benchmarked against the Snapdragon 865, slightly inferior to the Snapdragon 865, with about 90% of the performance of the Snapdragon 865. The Dimensity 1000Plus integrates MediaTek's latest 5G chip.
Performance metrics: The main indicators that affect its performance include the main frequency, the number of bits of the CPU, the cached instruction set of the CPU, the number of CPU cores, and the IPC (number of instructions per cycle). The so-called CPU frequency refers to the clock frequency.
It directly determines the performance of the CPU, and can be overclocked to increase the CPU frequency to obtain higher performance. The number of bits of the CPU refers to the number of bits of floating-point number that the processor can calculate at one time.
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The Dimensity 1000+ is equivalent to the Snapdragon 865
From the configuration, they all use 7nm process technology, Dimensity 1000+ The former has four A77 large cores, GPU is Mali-G77, Snapdragon 865 is equipped with 1 A77 core with a main frequency, 3 A77 large cores with a main frequency, GPU is Adreno 650, Dimensity 1000+ integrated 5G baseband chip, Snapdragon 865 adopts an external X55 5G baseband design scheme, Dimensity 1000+ and Snapdragon 865 The gap is not big.
Running scores. The Dimensity 1000+ scored 784 points in single-core and 3043 points in multi-core, and is only one step away from the Snapdragon 865 (891 3116).
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The Dimensity 1000+ is equivalent to the Snapdragon 865
From the configuration, they all use 7nm process technology, Dimensity 1000+ The former has four A77 large cores, GPU is Mali-G77, and Snapdragon 865 is equipped with 1 A77 large core with a main frequency.
3 A77 cores with main frequency, GPU Adreno 650, Dimensity 1000+ integrated 5G baseband chip, Snapdragon 865 adopts the design scheme of external X55 5G baseband, the gap between Dimensity 1000+ and Snapdragon 865 is not large.
In terms of running scores, the Dimensity 1000+ scored 784 points in single-core and 3043 points in multi-core, and is only one step away from the Snapdragon 865 (891 3116).
The 5G power consumption is further reduced, the support for the 144Hz refresh rate is added, the network, load, and power consumption of the mobile phone are further optimized and adjusted during gaming, and a new image quality engine is added, which can adjust the ** image quality and enhance the HDR effect frame by frame from the hardware and software aspects.
The 1000 PLUS uses a 7nm process technology to improve the energy consumption ratio of the SoC, further reducing its heat generation and power consumption, and for mobile products such as mobile phones, higher energy efficiency ratio and lower temperature will greatly improve the daily use experience of mobile phones.
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Snapdragon 870.
The Dimensity 1200 is manufactured on TSMC's 6nm process, which is a slightly modified version of the 7nm process, with 1 Cortex-A78 large core + 3 Cortex-A78 medium cores + 4 Cortex-A55 small cores. The three core frequencies are respectively, Dimensity 1200 is very familiar with Snapdragon's latest 870 in terms of performance, but theoretically, the i-art process is more advanced, and the comprehensive core frequency is not much different, so the actual performance of the two chips should be between the two, in order to increase the ultimate performance, the main frequency is relatively high.
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The Dimensity 1200 is equivalent to the Snapdragon 870. The Snapdragon 870 has 1 Cortex - A77 large core + 3 Cortex - A77 medium core + 4 Cortex - A55 small core, and the three core frequencies are respectively , which is an upgraded version of the Snapdragon 865, and the Dimensity 1200 has 1 Cortex - A78 large core + 3 Cortex - A78 medium core + 4 Cortex - A55 small core.
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Snapdragon 870. Dimensity 1200 (MT6893) in Geekbench5, single-core score 886, multi-core score 2948 points. In the CPU part, the Tianji 1200 has improved by about 25%, but the Snapdragon 888 has a higher core frequency and better performance.
The Dimensity 1200 is manufactured on TSMC's 6nm process, which is a slightly modified version of the 7nm process, with 1 Cortex-A78 large core + 3 Cortex-A78 medium cores + 4 Cortex-A55 small cores. The three core frequencies are, Dimensity 1200 is very familiar with Snapdragon's latest 870 in terms of performance, but theoretically the process is more advanced, and the comprehensive core frequency is not much different, so the actual performance of the two chips should be between the two chips, and the main frequency is relatively high in order to increase the ultimate performance.
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The Dimensity 1200 is equivalent to the Snapdragon 870.
1. CPU architecture.
The Snapdragon 870 has 1 Cortex-A77 large core + 3 Cortex-A77 medium cores + 4 Cortex-A55 small cores. The three core frequencies are an upgraded version of the Snapdragon 865.
The Dimensity 1200 has 1 Cortex-A78 large core + 3 Cortex-A78 medium cores + 4 Cortex-A55 small cores. The three core frequencies are:
Second, GPU.
The Snapdragon 870 uses its own Adreno650, and the frequency is directly dry to 670MHz, which is nearly 100MHz higher than the 587MHz of the Snapdragon 865 standard version, but it is a small amount compared to the third-party overclocked version; Dimensity 1200 uses the public version of ARMG77MC9, the performance is 13% higher than the previous generation, slightly better than the Snapdragon 870, Fa Ge still has room for improvement.
Third, the production process.
The Snapdragon 870 is equipped with TSMC's 7nm manufacturing process, which brings a good power consumption performance experience; The Dimensity 1200 is equipped with TSMC's 6nm manufacturing process, which is an upgraded version of 7nm.
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The Dimensity 800U is a processor equivalent to the Kirin 820, and the overall level is slightly better than the Kirin 820.
The Dimensity 800U processor adopts a 2+6 octa-core CPU architecture, with 2 Cortex-A76 cores and 6 Cortex-A55 high-efficiency cores, and supports LPDDR4X memory and flash memory.
In terms of Antutu running scores, the Honor Play4 equipped with MediaTek Dimensity 800 has a running score of about 320,000 points, while the Honor X10 running score can reach about 10,000 points, and the performance gap between the two is still obvious.
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The Dimensity 800U is equivalent to the Snapdragon 765G, and there is little difference between the two in terms of parameters and manufacturing process.
The Dimensity 800U is powered by two Cortex-A76 cores and six Cortex-A55 cores.
The Dimensity 800U is powered by an ARM Mali G57 GPU with an integrated discrete MediaTek APU.
Snapdragon 765G Comparison:
Compared with the previous generation Snapdragon mid-range processor, the Snapdragon 765G has increased the frequency of the Snapdragon 730 large core, and adopts the architecture of 1*kryo 475 prime ( 475 gold ( 475 silver ().
This processor uses Samsung's 7nm EUV process, which reduces power consumption by 35% compared to the 8nm Snapdragon 730, and the GPU is upgraded to Adreno 620.
Snapdragon 765G supports up to 192MP pixels, single-camera 3600W pixel zero-latency shooting, which is comparable to the previous generation, supports Bluetooth and 120Hz refresh rate, AI computing power.
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The AP performance is similar to that of the Snapdragon 765G, and the overall actual experience is slightly lacking.
The Dimensity 1000+ has a processor between the Snapdragon 855 and the Snapdragon 865. Just looking at the running score data, it is better than Kirin 990, and the key is to see the optimization ability of major mobile phone manufacturers for this CPU.
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