How to write the steps and process of copying the board of the user board of the MCU course?

The first step is to get a PCB, first record the model, parameters, and positions of all the components on paper, especially the direction of the diode, the three tubes, and the direction of the IC notch. It is best to use a digital camera to take two pictures of the position of the energy parts**.

In the second step, remove all the components and remove the tin from the pad holes. Clean the PCB with alcohol, and then put it in the scanner, the scanner needs to slightly increase the scanning pixels in order to get a clearer image, start the pohtoshop, sweep the silk screen surface in color, save the file and print it out for later use.

The third step is to lightly polish the top layer and bottom layer with gauze paper until the copper film is shiny, put it in the scanner, start Photoshop, and sweep the two layers into it in color. Note that the PCB must be placed horizontally and vertically in the scanner, otherwise the scanned image will not be usable and the file will be saved.

The fourth step is to adjust the contrast and brightness of the canvas to make the contrast between the part with the copper coating and the part without the copper coating strong, and then turn the secondary picture to black and white, check whether the lines are clear, if not, repeat this step. If it is clear, save the image as a black and white BMP format file, and if you find that the graphics are problematic, you can also use Photoshop to patch and correct.

The fifth step is to convert the two BMP files to the Protel format files respectively, and transfer the two layers in the Protel, such as the positions of the pad and the VIA through the two layers basically coincide, indicating that the first few steps are doing well, if there is a deviation, repeat the third step.

Sixth, convert the bmp of the top layer to the silk layer, which is the yellow layer, and then you can trace the line in the top layer, and place the device according to the drawing in the second step. Delete the silk layer when you're done.

The seventh step is to convert the BMP of the bot layer to the silk layer, which is the yellow layer, and then you can draw the line in the bot layer. Delete the silk layer when you're done.

The eighth step is to transfer and transfer in protel, and it is OK to combine them into one diagram.

Step 9: Use a laser printer to print the top layer and bottom layer on the transparencies (1:1 ratio), put the film on the PCB, compare whether there is any error, if it is correct, you are done.

Other: If it is a multi-layer board, it is necessary to carefully polish to the inner layer inside, and repeat the steps from the third to the ninth at the same time, of course, the naming of the graphics is also different, according to the number of layers, the general double-sided board copy board is much simpler than the multi-layer board, and the multi-layer board copy board is prone to misalignment, so the multi-layer board copy board should be particularly careful and careful (the internal through hole and non-through hole are easy to have problems).

Your teacher teaches copying boards? The books I read are fed to the dogs, ah......

What PCB board are you, can you send ** to see not? Or contact me. I'll give you a copy of the board.

First of all, the preparation of the PCB disassembly.

When disassembling a PCB, the intact original board is split into light boards and components, so it is particularly important to prepare for BOM list creation in the disassembly. Professional dismantling personnel will generally prepare a blank paper and a pen before the PCB copy board, first write down the serial number and the position number of the components on the paper, after each component is disassembled, the corresponding position number is pasted on the white paper with double-sided tape or the like. However, it should be noted that in the process of splitting the board, it is necessary to be careful about the numbering arrangement of the components, because the error of the position information of one component may lead to the inaccuracy of the entire BOM list and affect the cloning effect.

Then, a bridge tester is used to make a BOM**.

After getting the sequence list that records the component information, it enters the process of making the BOM sheet, and summarizes all the relevant parameters of the components into the form of information through a professional testing equipment - bridge tester test and analysis.

Finally, the accuracy of the BOM list was checked.

The judgment of the accuracy of the BOM list is usually relatively strict, and the statistics are often based on the single-layer structure as a unit, as long as there is a discrepancy, then the accuracy of the layer structure is judged to be 0. This inspection method can ensure the accuracy of the BOM order to the greatest extent. (**：

Step 1: Get the PCB board that needs to be copied, and first use the camera to take a few photos of the position of the components, especially the direction of the diode, the transistor, and the direction of the IC notch. Then the model, parameters and positions of all components are recorded in detail on paper.

Step 2: Remove all the components on the board to copy the board file, and remove the tin from the pad holes. Clean the PCB with alcohol and put it in the scanner, and the scanner needs to slightly increase the scanning pixels to get a clearer image.

Slightly sand the top and bottom layers with sandpaper until the copper film is shiny, put them in the scanner, start Photoshop, and sweep the two layers into them in color.

Note: The PCB must be placed horizontally and vertically inside the scanner, otherwise the scanned image will not be usable.

Step 3: Adjust the contrast, brightness and darkness of the canvas to make the contrast between the part with the copper coating and the part without the copper coating strong, and then turn the picture to black and white to check whether the lines are clear. If it is not clear, repeat this step.

If it is clear, save the picture as a black and white BMP format file, and if you find that there is a problem with the graphic, you can also use Photoshop to patch and correct.

Step 4: Convert the two BMP files to Protel files, and transfer two layers in Protel, if the positions of the two layers of Pad and VIA basically coincide, it means that the previous steps are done well. If there is a deviation, repeat the third step.

Step 5: Convert the BMP of the top layer to the silk layer, that is, the yellow layer, and then trace the line in the top layer, and place the device according to the drawing in the second step. Delete the silk layer when you're done.

Keep repeating to know that all the layers are drawn.

Step 6: Mix and in protel, and combine it into one picture.

The seventh step, use a laser printer to print the top layer and bottom layer to the transparencies at a ratio of 1:1, put the film on the PCB, compare whether there is a mistake, if it is right, the copy board is basically completed, and finally the performance test of the copy PCB board, if it is the same as the original PCB performance, it means that the copy board is completely completed.

If it is a multi-layer board need to be carefully polished to the inner layer inside, while repeating the third to fifth steps of the board copying steps, of course, the naming of the graphics is also different, to be determined according to the number of layers, the general double-sided board copy board is much simpler than the multi-layer board, copy the multi-layer board is prone to misalignment, so the multi-layer board copy board should be particularly careful and careful (the internal through hole and non-through hole is easy to have problems).