The principle of negative photoresist, the principle of action and use of photoresist

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When the photoresist receives a certain wavelength of light or rays, a photochemical reaction or excitation will occur accordingly. Light absorption in a photochemical reaction is caused when an electron in the outermost shell of an atom moves from the ground state to the excited state that plays a role in chemical bonding. For organic matter, the energy difference between the ground state and the excited state is 3 6 EV, which is equivalent to the energy difference of light (i.e., light of wavelength) is strongly absorbed by the organic matter, so that the electrons that play a role in chemical bonding are transferred to the excited state.

Chemical bonding undergoes a chemical change when it is subjected to this excitation, or when it separates or changes the bonding object. When electron beams, X-rays, and ion beams (i.e., particles that are accelerated) are injected into matter, the energy gradually disappears due to the interaction with the electrons possessed by the matter. The energy lost by the electron beam is transferred to the electrons of the substance, thus generating electrons or secondary electrons or ions in the excited state.

These electrons or ions can induce the chemical reaction of the luminescent resist.

Photoresists are a large class of polymer materials with photosensitive chemistry (or sensitivity to electron energy) that are mediums for transferring UV** or electron beam exposure patterns. The English name of photoresist is resist, which is also translated as resist, photoresist, etc. The role of the photoresist is to protect the surface of the substrate as an anti-etching layer.

Photoresist is just a figurative statement because photoresist appears as a gelatinous liquid in appearance.

Photoresists are usually evenly covered on the surface of the substrate in the form of a thin film. When irradiated by ultraviolet light or electron beam, the characteristics of the photoresist material itself will change, and after the developer develops, the negative photoresist or the positive photoresist will remain on the surface of the substrate, so that the designed micro-nano structure will be transferred to the photoresist, and the subsequent etching, deposition and other processes can further transfer the pattern to the substrate under the photoresist, and finally use a gel remover to remove the photoresist.

The function of the photoresist is to cure the photoresist through the irradiation of ultraviolet light, wash off the uncured resin with a solvent, and then corrode the copper plate without resin to form a circuit. Photoresists, also known as electronic inks, are composed of light-curing resins and heat-curing resins. The light-curing resin can be cured with ultraviolet light, so as to avoid being washed off by solvents, and the heat-curing resin can be further cured by heating, and the fully cured resin can play a good protective role in the electric furnace.

Summary. Hello, if you compare, the accuracy of the positive photoresist will be more accurate than the accuracy of the negative photoresist. After the negative glue was developed, the pattern was expanded and contracted, and the negative glue was limited to 2 3 m

The resolving power of positive glue is better than that of the positive glue, which affects the accuracy, while the positive glue has no effect in this regard. However, for positive and negative photoresists of the same thickness, negative photoresists will be better when dealing with wet or corrosive problems. This is the pros and cons of both sides.

Hello, if you compare, the accuracy of the positive photoresist will be more accurate than the accuracy of the negative photoresist. After the negative glue was developed, the pattern was expanded and contracted, and the negative glue was limited to 2 3 m, while the resolution of positive glue is superior to the macro that leads to the impact on accuracy, and positive glue has no early influence in this regard.

However, for positive and negative photoresists of the same thickness, negative sales of sparrow photoresist will be better when dealing with wet or corrosive problems. This is the pros and cons of both sides.

Excuse me, teacher, what are the suggestions for improving the mask imposition of the film process?

Hello. Using a thinner adhesive layer thickness can improve the resolution of the negative adhesive, but the thin negative adhesive will affect the pinhole, so it is better to choose positive adhesive as much as possible. Annihilation of the world.

Positive photoresist is used for line width, and negative photoresist is used for line narrowness.

Teacher, for the thin film process, which kind of film is the negative photoresist more suitable for the production of the accompaniment cavity? There is also the thickness control of the negative reed lithography rubber, how much can the pass rate be guaranteed?

Hello. For thin-film processes, negative photoresists are more suitable for thin-film transistor thin film fabrication. The negative photoresist should be controlled at 2-3 microns.

Excuse me, teacher, do you have any recommended articles on technological innovation in this area?

Dear, you can go to CNKI, there are a lot of good articles to read.

SHN-1 type biazide-cyclobridged isorock cherry tree rubber bijube mammothic ultraviolet negative photoresist Photoresist is an indispensable key material in the microfabrication of the electronics industry. Its invention and application have promoted the development and production of semiconductor integrated circuits. During the Sixth Five-Year Plan period, China imported from Japan and other countries.

Fudan Journal (Natural Science Edition), No.01, 1987.

For example, in this article, I think the description of photoresist is very detailed and very good.

Teacher, what is the difference between the imported negative photoresist SU-8 and the domestic negative photoresist ROL-7133?

Hello, the SU-8 photoresist has a very low light absorption in the range of near-ultraviolet light (365nm-400nm), and the amount of light obtained by the entire photoresist layer is uniform, and a thick film pattern with vertical sidewalls and a high aspect ratio can be obtained; It also has good mechanical properties, chemical resistance and thermal stability. SU-8 is cross-linked after being exposed to ultraviolet radiation, which is a kind of chemically expanded negative glue, which can form complex structural patterns such as steps; In addition, SU-8 adhesive is non-conductive and can be used directly as an insulator during electroplating.

Positive glue development: The photoresist in the ** region of the positive photoresist is dissolved in the developer to form a three-dimensional pattern on the photoresist.

Negative adhesive development: The photoresist in the non-** region of the negative photoresist is dissolved in the developer and a three-dimensional pattern is formed on the photoresist.

Zhengjiao has a good contrast, so the generated graphics have a good resolution, and other characteristics such as good step coverage and good contrast of Qingkuan; Poor adhesion, poor etching resistance, high cost.

The characteristics of negative adhesive are that it has good adhesion ability and blocking effect, and fast light sensitivity; Brightness aberration and deformation and expansion occur during development, so it can only be used for a resolution of 2 m.

Photolithography begins with a type called photoresist.

The application of photosensitive liquids. Graphics can be mapped onto photoresists, and then a developer can create the required template patterns. Photoresists are also known as photoresists.

It is a smart tube photosensitive material, which irradiates and solubilizes light.

There are changes. Photoresist composition.

Photoresists typically have three components: photosensitive compounds, matrix materials, and solvents. Sensitizers are sometimes included in photosensitive compounds. Depending on how the photoresist responds to UV light.

The properties can be divided into two categories: negative photoresists and positive photoresists.

1. Negative photoresist.

There are two main categories: polycinnamic acid (polyester rubber) and cyclic rubber, the former is represented by Kodak's KPR, and the latter is represented by OMR series.

2. Positive photoresist.

Diazoneone is mainly used as a photosensitive compound, and phenolic resin is used.

for the base material. The most used ones are the AZ-1350 series. The main advantage of positive glue is high resolution, and the disadvantage is poor sensitivity, etching resistance, and adhesion.

Characteristics of photoresists.

1. The dissolution rate changes under the irradiation of light, and the dissolution rate difference between the ** region and the non-** region is used to realize the transfer of the figure;

2. Dissolution inhibition: Dissolution promotion and joint action;

3. The mechanism of action varies according to the different types of photoresists;

The main technical parameters of the photoresist.

1. Resolution: The ability to distinguish the adjacent pattern characteristics on the surface of a silicon wafer, and the resolution is generally measured by the key size. The smaller the key size formed, the better the resolution of the photoresist.

2. Contrast.

Refers to the steepness of the photoresist transition from the ** region to the non-** region. The better the contrast, the steeper the side walls that form the graph, and the better the resolution.

3. Sensitivity: the minimum energy value (or minimum amount) of a certain wavelength required to produce a good pattern on the photoresist. Unit:

millijoules square centimeters or mj cm2. The sensitivity of the photoresist is particularly important for deep ultraviolet light (DUV), very deep ultraviolet light (EUV), etc., which have shorter wavelengths.

4. Viscosity Viscosity: a parameter that measures the flow characteristics of photoresist. Viscosity increases with the reduction of solvent in the photoresist; High viscosity produces a thick photoresist; The smaller the viscosity, the more uniform the photoresist thickness.

5. Adhesion: characterize the adhesion of photoresist to the substrate.

strength. Insufficient adhesion of the photoresist can lead to pattern distortion of the silicon wafer surface.

6. Corrosion resistance: The photoresist must maintain its adhesion and protect the substrate surface in the subsequent etching process.

7. Surface tension.

An intermolecular force of attraction in a liquid that pulls a surface molecule towards the body of the liquid. The photoresist should have a relatively small surface tension, so that the photoresist has good flow and coverage.

8. Storage and transmission: Energy can activate the photoresist. It should be stored in an airtight, low-temperature, opaque box. At the same time, the idle period and storage temperature environment of the photoresist must be specified.

The main role of photoresist.

1. Transfer the pattern on the mask to the oxide layer on the surface of the silicon wafer;

2. In the subsequent process, protect the underlying material (etching or ion implantation).

As an indispensable material in the semiconductor manufacturing process, photoresist is mainly used to chemically change the photosensitive components in the photoresist under the irradiation of light, so as to achieve the purpose of transferring the pattern on the mask to a surface such as a silicon wafer. The main components of photoresist are film-forming resin, photosensitive components, trace additives and solvents, among which film-forming resin is used to provide mechanical properties and anti-etching ability; The photosensitive components undergo chemical changes under light irradiation, causing a change in the dissolution rate. Trace additives include dyes, tackifiers, etc., to improve photoresist performance; Solvents are used to dissolve the components and mix them evenly.

Photoresist can be divided into ultraviolet, deep ultraviolet, extreme ultraviolet, electron beam, ion beam and X-ray photoresist according to the photosensitive wavelength, and the commonly used photoresist is ultraviolet and deep ultraviolet photoresist, and the extreme ultraviolet photoresist will be applied at 10nm and below nodes.

Answer: In the process of developing a photograph, when it is processed with an appropriate solvent (developer), the unsensitive part is processed off, and the photosensitive part is retained because it does not dissolve, resulting in an image that is the opposite of the negative (called a negative image). This type of photolithography coating material is called a negative photoresist.

The o-diazoquinone is insoluble in dilute alkali, when irradiated by light, nitrogen is released, and it becomes an enkenone that can be hydrolyzed to generate a carboxyl group, so that the polymer is dissolved in dilute alkali, positive photoresist belongs to this category, the irradiated part is dissolved in the developer (dilute lye), and the unilluminated part remains unchanged, showing the image, which is called a positive image. Positive and negative photoresists can be used in the manufacture of integrated circuits, photographic negatives, printing, laser discs and many other aspects.

Summary. There is no benzene in the positive and negative photoresist chemistry. Photoresist is a special polymer, its main component is polyurethane, which contains organic substances such as styrene, toluene, xylene, etc., but does not contain benzene.

The preparation process of photoresist mainly includes batching, mixing, stirring, coating, drying and other steps. First of all, according to the formula, mix polyurethane, solvent, plasticizer, antioxidant, anti-ultraviolet agent, heat anti-aging agent, anti-aging agent, etc. in proportion, and then stir and mix to make it uniform; Next, the mixture is applied to a glass plate and dried in an oven to form a film; Finally, the dried film is cut into photoresist to obtain a photoresist. In the preparation of photoresists, there is no benzene, therefore, there is no benzeneness in the chemical composition of positive and negative photoresists.

There is no benzene in the positive and negative photoresist chemistry. Photoresist is a special polymer, its main component is polyurethane, which contains organic substances such as styrene, toluene, xylene, etc., but does not contain stupid. The preparation process of photoresist mainly includes batching, mixing, stirring, coating, drying and other steps.

First of all, according to the formula, mix polyurethane, solvent, plasticizer, antioxidant, anti-ultraviolet agent, heat anti-aging agent, anti-aging agent, etc. in proportion, and then stir and mix to make it uniform; Next, the mixture is applied to a glass plate and dried in an oven to form a film. Finally, the potatoes are washed and the dried film is cut into photoresist to obtain photoresist. In the preparation of photoresists, there is no benzene, therefore, there is no benzeneness in the chemical composition of positive and negative photoresists.

Fellow, I really didn't understand, I can be more specific.

Generally speaking, there is no benz in the positive and negative photoresist chemistry. Positive and negative photoresist is a special photoresist, which is composed of polyurethane, polyvinyl chloride, polyvinyl alcohol, polyethylene ether, polyvinyl ester, polyurethane emulsion and other special organic substances, they are non-toxic, harmless, and do not contain stupid. The main function of positive and negative photoresist is to convert information such as graphics or wild positive text into graphics on the photoresist, so as to realize the function of printed circuit boards.

Positive and negative photoresists are characterized by good optical properties, can resist high temperatures, high humidity and high temperature environments, have good wear resistance and corrosion resistance, and can meet the high requirements of circuit boards. Positive and negative photoresists are widely used, it can be used in printed circuit boards, electronic components, electronic component packaging, electronic component manufacturing, electronic component assembly, etc., which can meet the needs of different industries. The use of positive and negative photoresists can improve the quality of printed circuit boards, improve the reliability of electronic components, and improve the service life of electronic components, thereby improving the performance of electronic components.