When converting lead free wave soldering, the temperature of the tin pot is important, and are there

In the production and manufacturing of electronic components, soldering work is often required. Among them, wave soldering and selective wave soldering are two common welding methods. Although they both use thermal energy to connect electronic components to circuit boards, there are certain differences between them in practical applications.

Wave soldering is a traditional type of welding. In the wave soldering process, the solder is glued to the circuit board where the electronic components are already installed, and then the solder is melted by heating so that it can be bonded to the electronic components and the circuit board to form a complete connection. During the soldering process, the soldering equipment immerses the circuit board in molten solder so that it is connected to the surface of the solder joints covered by the electronic components.

As the solder cools, the solder joints and electronic components are firmly connected to the circuit board....

1.The equipment itself does not need to be replaced with titanium alloy, which is not available in the world now, and 316 stainless steel is fine. The original factory is also this thing, titanium alloy wholesale by catty, a tin steel 180 catties, materials are tens of thousands.

If you use a lead cylinder, you can also use it, but you have to wash it with pure tin first, you can't do this, find someone who sells tin to do it.

2.The temperature has not changed much, it turned out to be 245, lead-free 245 is OK, depending on what tin rod you use, the tin rod is added to 255 cheaply, and the tin is the highest for 2 times to be reduced, otherwise the copper will be stratified. Remember.

I avoid using the cardboard, and I am very deformed.

The wave must have a backflow. It is larger than lead, and it should be actively reflowed.

5.The 2nd wave must use a wide mirror wave, the track angle is low, and the desoldering point is placed behind.

And then you do it according to the lead, so there is so much oxidation and so much so the problem. There is only one minimum principle, and the lead content should not be exceeded. Everything else is fine. You must know that many materials actually still have lead process limits, so the parameters depend on the specific board and model.

You asked, after I graduated, I worked as a wave solder for four years in Shenzhen. The tin pot is replaced with titanium alloy, and the PCB has no special requirements, just use a special lead-free flux, but the lead-free is super difficult to solder, and the oxidation rate is too fast.

Share a PCB Technology Group--- Electronic Family PCB Technology 010 Group: 234212581. Share with each other and make progress together. PCB technology --- we fight for!

Summary. Hello, working principle: Wave soldering uses the principle of convective heat transfer to heat the solder area. The molten solder wave acts as a heat source, which on the one hand flows to wash away the pin solder zone, and on the other hand, it also acts as a heat conductor, and it is under this action that the pin solder zone heats up.

When using silver-tin solder, the molten solder temperature is usually controlled at about 245.

What is the principle of less tin reduction after preheating during wave soldering?

Hello, the working principle is to use the principle of convective heat transfer to heat the soldering area. The molten solder wave acts as a heat source, which on the one hand flows to wash the pin solder area, and on the other hand, it also acts as a heat conduction, and the pin solder area is heated by the action of Nian Shaochun.

When using silver-tin solder, the molten solder temperature is usually controlled at about 245.

Is it still there? Teacher.

In. What is the principle of less tin reduction after preheating during wave soldering? Please ask the teacher to answer for me, thank you

Hello, the working principle is to use the principle of convective heat transfer to heat the soldering area. The molten solder wave acts as a heat source, which on the one hand flows to wash the pin solder area, and on the other hand, it also acts as a heat conduction, and the pin solder area is heated by the action of Nian Shaochun.

When using silver-tin solder, the molten solder temperature is usually controlled at about 245.

For small lead-free wave soldering, the temperature of the brazing chute is generally 25 270. For each flux, the coating method and application amount, preheating temperature and time are all optimized. In order to achieve a thermal shock of less than 100 degrees to protect the components, a long shaft must be used, and inert gas must be used to increase the first-pass rate and reduce the amount of brazing sludge.

The slag formation of SAC fiber and SN-37PB brazing metal is similar, while the slag formation of SN-Cu brazing metal is quite large. Other process parameters, such as conveyor belt speed, residence time and immersion depth, component mounting and soldering direction, all affect the first-pass rate and quality of small lead-free wave soldering, but there is no difference between lead-free and leaded brazing filler metals. For wave soldering without brazing filler, the composition of the melt in the brazing tank is closely monitored.

Small lead-free wave soldering.

Wave soldering refers to the soldering of the molten solder (lead-tin alloy) through an electric pump or electromagnetic pump into the solder peak required by the design, or by injecting nitrogen into the solder pool, so that the printed board pre-loaded with components passes through the solder crest to realize the mechanical and electrical connection between the solder end of the component or the pin and the printed board pad.