How many types of integrated circuits are there? What are the main categories of integrated circuit

Category 2, general purpose and specialty.

The integrated circuit process is mainly divided into three categories: semiconductor integrated circuits, film integrated circuits and hybrid integrated circuits.

Semiconductor integrated circuits are the use of semiconductor process technology.

It is made on a silicon substrate including resistors, capacitors, and transistors.

integrated circuits of diodes and other components; Membrane integrated circuits are integrated circuits that make passive components such as resistors and capacitors in the form of "films" on insulating objects such as glass or ceramic sheets.

The numerical range of passive components can be very wide and the accuracy can be very high. The technical level is not yet able to make active devices such as crystal diodes and transistors in the form of "film", so the application scope of film integrated circuits is greatly limited. In practical applications, most of them are on and outside passive membrane circuits.

Diodes, triodes and other active devices with semiconductor integrated circuits or discrete components are added to form a whole, which is a hybrid integrated circuit.

According to the thickness of the film, the film integrated circuit can be divided into two types: thick film integrated circuit (film thickness of 1 10 m) and thin film integrated circuit (film thickness of less than 1 m). In the process of home appliance maintenance and general electronic manufacturing, semiconductor integrated circuits, thick film circuits and a small number of hybrid integrated circuits are mainly encountered.

The integrated circuit process is divided into monolithic integrated circuits based on silicon planar technology, thin-film integrated circuits based on thin-film technology, and thick-film integrated circuits based on screen printing technology.

1. Monolithic integrated circuit process.

Using a complete set of planar process technologies such as grinding, polishing, oxidation, diffusion, and photolithography, transistors, diodes, resistors and capacitors are manufactured simultaneously on a small silicon single wafer, and certain isolation technology is used to isolate each component from each other in electrical properties. The aluminum layer is evaporated on the surface of the silicon wafer and etched into an interconnection pattern by photolithography technology, so that the components are interconnected into a complete circuit as needed, and a semiconductor monolithic integrated circuit is made.

2. Thin-film integrated circuit process.

Circuit elements, devices and their wiring are made on sapphire, quartz glass, ceramics and copper-clad laminate substrates by thin film technology, and encapsulated. Thin film processes include evaporation, sputtering, chemical vapor deposition, etc. It is characterized by accurate numerical control of resistance and capacitance, and a wide range of values, but the integration is not high, and it is mainly used for linear circuits.

3. Thick film integrated circuit process.

Thick film hybrid integrated circuits are characterized by more flexible design, simple process and low cost, which are especially suitable for multi-variety and low-volume production. In terms of electrical performance, it can withstand higher voltages, higher powers and larger currents. Thick-film microwave integrated circuits can operate at frequencies above 4GHz.

It is suitable for all kinds of circuits, especially analog circuits for consumer and industrial electronics.

There are two types of IC manufacturing technology, one is monolithic technology and the other is hybrid technology. In monolithic technology, all electronic components and their interconnects are manufactured together into a single silicon chip. This technology is suitable for mass production of the same ICs, although monolithic ICs are cheap but reliable.

In a hybrid IC, individual components are attached to a ceramic substance and connected to each other by wires or metallization patterns, as shown in the figure below

Integrated circuits, also known as ICs, can be divided into three categories: analog integrated circuits, digital integrated circuits and digital-analog mixed integrated circuits according to their different functions and structures.

1. Analog integrated circuits, also known as linear circuits, are used to generate, amplify and process various analog signals, which refer to signals whose amplitude changes with time. For example, the audio signal of a semiconductor radio, the tape signal of a VCC, etc., the state or filial piety is proportional to the input signal and the output signal.

2. Integrated circuits can be divided into semiconductor integrated circuits and film integrated circuits according to the manufacturing process. Film sail draft integrated circuits are further classified into thick film integrated circuits and thin film integrated circuits.

3. Integrated circuits can be divided into bipolar integrated circuits and unipolar integrated circuits according to the type of conduction, and the other liquids are digital integrated circuits.

The manufacturing process of bipolar integrated circuits is complex and the power consumption is large, and the representative integrated circuits are TTL, ECL, HTL, LST-TL, STTL and other types. The manufacturing process of unipolar integrated circuits is simple, the power consumption is also low, and it is easy to make large-scale integrated circuits, which means that there are CMOS, NMOS, PMOS and other types of integrated circuits.

Integrated circuits can be divided into three categories: analog integrated circuits, digital integrated circuits, and digital-analog mixed integrated circuits according to their different functions and structures.

Analog integrated circuits, also known as linear circuits, are used to generate, amplify, and process various analog signals (referring to signals whose amplitude changes with time. For example, the audio signal of a semiconductor radio, the tape signal of a VCC, etc.), the input signal and the output signal are proportional to the loss of the case. Digital integrated circuits are used to generate, amplify, and process various digital signals (refers to signals with discrete values in time and amplitude.

<> classification of integrated circuits can be as follows:

Classified according to function: analog integrated circuits, digital integrated circuits, digital-analog mixed integrated circuits.

According to the classification of production process: semiconductor integrated circuits, anti-volcanic thin film integrated circuits, thick film integrated circuits, embedded integrated circuits, planar integrated circuits, bipolar integrated circuits, unipolar integrated circuits, variable capacitor integrated circuits, optoelectronic integrated circuits, sensor integrated circuits, logic integrated circuits, microprocessor integrated circuits, single-chip integrated circuits, and other integrated circuits specified in national standards.

Common integrated circuits are: for example, the chip on the motherboard of the mobile phone, the chip used in the CPU of the mobile phone, the chip used in the digital camera, the chip on the laptop computer, etc.