Application of plasma cleaning in LCD technology

Plasma cleaning equipment application: optoelectronic manufacturing industry: flexible and non-flexible printed circuit board contact cleaning LCD fluorescent tube "contact" cleaning.

The best way to corrode ITO is to clean it with a plasma cleaner.

The reason for the yellowing of LED panel lamps during production and processing is often the result of the stains attached to the light guide plate penetrated into the light guide plate due to the external use environment, or the material changes that occur in the light guide plate itself. It is the result of the plasma cleaning machine not treating the contaminants on the surface of the material.

However, there are often some problems in the LED production process that will cause the LED lamp beads to turn yellow, such as:

1) The main problem in the LED manufacturing process is that it is difficult to remove pollutants and oxide layers.

2) The stent and the colloid are not tightly combined and there are tiny gaps, and after being stored for a long time, the air enters to oxidize the electrode and the surface of the bracket and cause a dead lamp.

In fact, in the LED packaging process, plasma cleaning is not only to solve the problem of yellowing of lamp beads, but also the problem of filling delamination. Especially in the mini LED process that has emerged in the past two years, the application of plasma is even more indispensable.

In the LED packaging process, oxides and particulate contaminants on the surface of the device will reduce product reliability and affect product quality. Cleaning with a plasma cleaner before packaging can effectively remove the above contaminants.

The use of plasma cleaning machine before dispensing silver glue can greatly improve the surface roughness and hydrophilicity of the workpiece, which is conducive to silver glue tiling and chip pasting, and at the same time, it can greatly save the use of silver glue and reduce costs.

Plasma cleaning machine treatment before wire bonding can significantly improve its surface activity, improve bond strength and tensile uniformity of bond leads. In some cases, the bonding temperature can also be lowered, increasing throughput and reducing costs.

In the process of LED epoxy resin glue, contaminants can cause the bubble formation rate to be high. As a result, the product quality and service life are low, so avoiding the formation of air bubbles during the sealing process is also a concern.

The surface treatment of the LED before sealing is carried out by the plasma cleaning machine, the chip and the substrate will be more closely combined with the gel, the formation of air bubbles will be greatly reduced, and the heat dissipation rate and light emission rate will be significantly improved.

The application principle of plasma cleaning machine is that the surface of the workpiece can be well treated through chemical or physical action to achieve the removal of contaminants at the molecular level (generally the thickness is 3 30 nm), so as to improve the surface activity of the workpiece. The pollutants that are removed may include organic matter, epoxy resin, photoresist, oxide, microparticle pollutants, etc., and the application of plasma cleaning machine in the LED industry has greatly improved the yield of LED packaging.