What can be used to make the power potting compound soft after curing?

At present, there are three main types of potting compounds on the market: epoxy system, silicone system, and polyurethane system.

Epoxy system potting compound: the electrical insulation performance is relatively good, the heat resistance is poor (the applicable temperature range is relatively narrow), the stress is also poor, and cracks are easy to appear, which will affect the components. After curing, the colloidal hardness is also very high (not adjustable), it is easy to strain electronic components, and it is difficult to have a good impact resistance if the hardness is too high, and it is generally used in electronic components that do not have much requirements for environmental mechanics.

Such as: capacitors, transformers and electronic transformers and other electronic components.

Silicone potting compound: It has better modification ability and electrical insulation ability than epoxy resin, and the ability to resist cold and thermal shock is also quite excellent, it can withstand -60 200 cold and hot shock, does not crack, and maintains elasticity, and has the ability to improve the moisture-proof performance of electronic components, because it is an elastomer after curing (the hardness can be adjusted to hard, soft and very soft), so it can also play a good impact resistance in electronic components, and the resistance to outdoor ultraviolet rays and atmospheric aging is also very good. It can be widely used in electronic components working in various harsh environments.

Such as: automotive electronics ECU, ABS, outdoor transformers, ignition coils with high temperature resistance requirements and electronic equipment in coastal areas.

Polyurethane encapsulant: It has strong adhesion performance for most materials, especially for products with PVC, PC and other substrates, and the adhesion of polyurethane encapsulant is strong; Temperature resistance, stable between -60 and 150. Excellent high and low temperature impact resistance, low internal stress, no brittleness, no cracking, good toughness, and no damage to electronic components; Excellent water resistance and low water absorption; It has very good electrical insulation stability The speed can be adjusted arbitrarily according to the production requirements (general epoxy and silicone are not adjustable), and it can be cured without heating or heating to reduce power consumption; The curing heat release is low, the viscosity is thin, the permeability is strong, the sealing is good, it is very suitable for mechanical glue potting, and the efficiency is high; The hardness can be adjusted, from Shore A 30 to Shore D 80, which can meet different needs; The cost of small specific gravity, cost-effective, flame retardant and thermally conductive adhesive is lower than that of epoxy resin.

Polyurethane encapsulant is a kind of encapsulant between epoxy adhesive and silicone, and its hardness is slightly inferior to epoxy resin and higher than silicone, which can reach 50-70.

To sum up, according to your use requirements, you can choose the right potting compound, but in terms of cost, it is generally polyurethane and epoxy are lower, and silicone potting compound is more expensive.

The better brands of epoxy in China are: Huitian and Huili; The better polyurethanes are: Alald, Fuming; The better silicones are: WACKER, Dow Corning, and Huitian.

Power potting adhesive is divided into epoxy potting compound, which is hard after curing, and silicone potting adhesive is soft, follow up your own product, and choose the right product.

Are you after the ab group is tuned, or before the debugging.

1. Keep away from children.

2. Sealed storage of rubber materials. The mixed compound is used up at one time to avoid waste.

3. This product is not a dangerous product, but do not enter and see hail.

4. After long-term storage, the filler in the glue will settle. Please stir well before use, it will not affect the performance.

5. The glue will not solidify when it comes into contact with a certain amount of the following chemicals

N, P, Bi Xianfan S organic compounds.

Ionic compounds of elements such as sn, pb, hg, as, etc.

Contains alkynes and polyvinyl compounds.