How to melt solidified epoxy glue

Use complex mechanical-physical means (cutting, blasting, abrasive brushes). Although the physical method is safer, the cost of equipment investment and disposal is too high. Small parts are inoperable.

2) Hot concentrated sulfuric acid soaking. Disadvantages: High hazardous, toxic, corrosive, although the easiest and lowest cost, but usually in the removal of hardened epoxy resin.

While encapsulating and curing the protective casing, it also corrodes all electronic components.

Component structure: metal and ceramic components.

3) Chloroform, ethyl acetate.

and other organic solvents are dissolved. Disadvantages: poor effect, long time. It's a helpless move.

4) It is best to use a professional epoxy resin dissolving solution. At present, the most efficient epoxy resin dissolving solution that can dissolve the cured epoxy resin on the market is as follows: 1) Shandong University of Science and Technology.

The product of the electronic laboratory epoxy resin dissolving solution is very easy to use, does not hurt the electronic board and components, and the dissolution speed is very fast, and it can be done in one hour. 2) Epoxy resin dissolving agent produced by Beijing Jinjiangsen Electronic Technology Research Institute 3) Epoxy resin softening remover cured by Wuxi Sanshan Electronic Materials Factory.

It shouldn't be able to melt anymore, so I guess I'll look at it after it ages.

Epoxy resin is a thermosetting plastic, with a cross-linked polymer structure, thermosetting plastic belongs to a class of insoluble and insoluble substances, and the chemical corrosion resistance of epoxy resin itself is very strong, and epoxy resin is heated and cured, I estimate that it can not be melted when heated to general temperature.

I don't know if there's really a way, but if you find it, please send a message.

1. Increase the temperatureTheoretically, for every 10 temperature increases, the curing speed can be 1 times faster.

2. Increase the dosage of acceleratorsFor example, the more accelerators, the faster it will cure.

3. Change the type of accelerator:It's best to use a more active accelerator. However, it should be noted that the activity is higher, then the latent is poor, if it is a one-component product, then you can find a balance, and two-component should not consider this.

4. Dosage of curing agent:It can be considered that changing the curing dose will change the structure of the cured object, which will also change the performance of the paint film or coating or product.

Precautions for the use of epoxy resin.

When using epoxy resin glue, you need to understand the instructions for use first, and you need to mix it when using it, so that the relatively large void can also be filled.

It is also necessary to pay attention to the temperature of the surrounding environment, preferably between minus 50 degrees Celsius and 150 degrees Celsius. Epoxy resin glue can be used in the general normal environment, can be waterproof, but also can prevent some aggressive substances, such as strong acid, strong alkali, etc. When storing epoxy resin glue, it can not accept direct sunlight, so the shade is the best environment for preservation, and the storage time of this glue is generally a certain period, and it can not be used after more than 12 months.

The curing process of epoxy materials is a very complex process of physical and chemical change, and there are many influencing factors. The curing process and influencing factors of epoxy resin can be summarized as follows: 1. Wetting and impregnation of solid materials (fibers, fillers, bonded surfaces, coating substrates, etc.) by epoxy adhesive solution (liquid epoxy resin glue, or epoxy resin solution, or epoxy resin melt). It can also be made into prepregs or molding compounds.

The main influencing factors are the compatibility of the glue with the solid material (affinity, which can be improved by adjusting the glue formulation design and solid surface treatment, etc.) and the viscosity of the glue (depending on the glue formulation and ambient temperature). 2. The material fills the mold cavity or leveling to form a dense object. The main influencing factor is the fluidity of the material, mainly the viscosity of the glue.

It all depends on the glue formulation and the ambient temperature. Pressurization and vacuuming can be used to assist in mold filling and the formation of dense objects. 3. Carry out the curing reaction.

Under certain conditions, epoxy oligomers begin to react with curing agents and modifiers, and solidify three-dimensional cross-linked structures from glue gelation to vitrification. The main influencing factor is the thermal history of the system. Includes:

Preheating temperature, ramp-up rate, curing temperature, curing time, post-curing temperature and time, etc. In addition, the curing pressure also plays a certain role in the curing reaction and the compactness and shape stability of the product. The main influencing factors are glue formulation and ambient temperature and humidity.

Fourth, the structure formation of epoxy matrix (epoxy cure). This is formed gradually as the curing reaction of the epoxy resin progresses. It includes the formation of the chemical structure of the solidified matter and the formation of the aggregate structure of the solidified matter.

The main influencing factor is the thermal history of the glue formulation and system. 5. The formation of the interface layer structure of epoxy materials. It is also gradually formed as the curing reaction of epoxy resin progresses.

It depends not only on the glue formulation and the thermal history of the system, but also on the surface properties of materials such as fibers and fillers. To sum up, the main factors affecting the curing process of epoxy materials are: glue formula and surface properties of solid materials such as fibers and fillers, which depend on the correctness of material design; - Thermal process and pressurization process, such as pressure, pressurization timing, pressurization times, etc., depends on the correctness of the process design, which is commonly referred to as the three major elements of the molding process: temperature, time, and pressure.

AG80 epoxy resin without reinforcing agent is a brownish-yellow viscous liquid at room temperature, so it won't solidify, right? If you say that AG80 has an expiration date, it will slowly lose its fluidity after 3-5 years and become a solid like rosin.

Hello, epoxy resin solidification after softening and soaking method: in other words, the product or object is completely soaked in acetone, then we will find that the colloidal will gradually soften, of course, this method also has limitations, that is, it needs to withstand the corrosive items of acetone before hail. Hot water immersion method:

It is fine to leave the item in hot water for 5-10 minutes, but this method depends on the material the item is attached to. You can also prepare a bottle of 500ml of vinegar, and about 25 200ml of liquor, mix the two, then put the object in it and soak it for 3-5 minutes, then wipe it with a cloth until it is completely clean. <>

The cured epoxy is a terminal polymer that cannot be turned back into a liquid, and it can only be hardened at a low temperature before the addition of aliphatic amine before curing, which can be heated up to restore a viscous liquid state. Two-component polymeric colloids such as epoxy, phenolic and polyurethane can no longer be broken down into their original form and are no longer dissolved by general organic solvents.

After the epoxy resin is cured, it is already a finished product, and if it needs to be reshaped, it needs to cooperate with a technical manufacturer to remove it by mechanical and physical means (cutting, sandblasting, grinding brush); If you use chemical solvents by yourself, it may cause damage to personnel and original base parts due to improper operation, and then increase the corresponding costs. (The above is a personal idea and is for reference only).

Acetone is very good, but acetone is really annoying because it is toxic and can only be used for cleaning, not back to gelatin.

Because epoxy resin glue is a thermosetting resin, it is irreversible after heating and curing.

Summary. Insulating oil: You can add an appropriate amount of insulating oil dropwise to apply it on the surface, and the glue can be melted after 3 minutes, and the common edible oil and gasoline also have the same effect, which can easily remove the solidified glue.

White vinegar: You can apply an appropriate amount of white vinegar to the solidified glue, wait for about 5 minutes to soften the glue, and then rinse the items with water or warm water to effectively remove the glue.

Insulating oil: You can add an appropriate amount of insulating oil dropwise to apply it on the surface, and the glue can be melted after 3 minutes, and the common edible oil and gasoline also have the same effect, which can easily remove the solidified glue. White vinegar:

An appropriate amount of white vinegar can be applied to the solidified glue, and the glue can be softened by waiting for about 5 minutes, and then the items can be rinsed with water or warm water to effectively remove the glue.

I'm a pound of glue, big brother.

The glue is solidified in the bottle, you can pour some hot water directly into the outside of the bottle, and let the glue melt inside the bottle through the temperature of the hot water, generally you need to soak the bottle in hot water, and it takes 30 minutes to completely melt the glue.

The curing speed of epoxy resin adhesive is determined by factors such as the type and amount of curing agent, ambient temperature and humidity. If you need to slow down the curing speed of epoxy resin glue, you can use the following methods:

1.Adjust the type and amount of curing agent: Different hardeners have different effects on the curing speed of epoxy resins. The curing speed can be adjusted by selecting the type and amount of hardener. In general, the lower the amount of hardener, the slower the curing speed.

2.Reduce the ambient temperature: The curing speed of epoxy adhesive is related to the ambient temperature, the higher the temperature, the faster the curing speed.

Therefore, lowering the ambient temperature can slow down the curing rate. The ambient temperature can be reduced by controlling the room temperature during the curing process or by using cooling devices and knowledge equipment.

3.Increase the activation temperature of the curing agent: The activation temperature of the curing agent refers to the temperature at which the curing agent starts to work. By choosing a curing agent with a higher activation temperature, the activation process of the hardener can be delayed, thus slowing down the curing speed.

4.Add retardant: A retardant is an additive that can slow down the curing of epoxy resin adhesives.

The retardant can react with the curing agent to form a stable intermediate product, which slows down the curing process. A suitable retardant can be selected to add to the epoxy adhesive according to the need.

It is important to note that adjusting the curing speed of epoxy adhesives requires the selection of the appropriate method based on the specific application needs and environmental conditions. In the actual operation, it should be tested and adjusted according to the actual situation to achieve the required curing speed.

In the case that the epoxy resin curing agent is not changed, it can be added lipids (dibutyl phthalate) and ketones (acetone.

and other substances make the curing speed slow down; Alternatively, polyamide can be selected.

Solid pants mold preparation agent, polyetheramine curing agent code rubber to make the epoxy resin glue curing slow.

When the temperature is lower than 15, the viscosity rises and it is not easy to mix evenly, so the glue is preheated to 30 first, so it is easier to flow out and easy to mix evenly; 0-15 can epoxy AB glue, good fluidity at low temperature, easy to operate, good strength.

When it is less than 10, the finished product after the epoxy AB glue reaction needs to be heated for 20-40 hours or wood drying room for more than 24 hours to ensure that the resin hardening reaction reaches more than 70%, and the complete reaction must be at standard room temperature (25) for more than 72 hours to achieve 100% complete reaction.

It can be used at -60 100 °C, and special adhesives such as ultra-low temperature resistant adhesive (-196 °C), high-temperature resistant adhesive (350 °C), electrically conductive, magnetically conductive, thermally conductive, spot welding, strain, photosensitive, flame retardant, underwater adhesive and other special adhesives can be prepared with new resins, special curing agents and fillers.

Epoxy AB glue. Epoxy AB glue is 100% solid content ingredients, so the caulking performance is excellent, after hardening, it can fill the voids of wood, steel and stone, and does not shrink and expand due to climate change, so the gluing places with large tenon aperture errors such as chair legs, car round tenon 45 degrees glued backrest assembly and armrest corner tenon are bonded with epoxy AB glue. Epoxy AB glue is generally thicker at a low temperature of less than 10° in winter, and the viscosity is high, which cannot be poured out, resulting in an unreasonable glue mixing ratio and affecting the bonding strength.

General epoxy resin AB glue is prone to the following problems in winter:

1.The mixing is uneven, in winter, the viscosity of the resin rises sharply due to the cold weather, the mixing is not easy to be uniform, the epoxy AB glue can not be completely hardened, and the poor gluing often occurs.

2.Even a small fraction of A and B adhesives are not mixed evenly, which can still cause adhesive bonding failure. It is best to stir again after 10 minutes after mixing the glue.

Workaround:

1) When the temperature is lower than 15, the viscosity rises and it is not easy to mix evenly, so the B glue is preheated to 30 first, so that it is easier to flow out and easy to mix evenly, when it is lower than 10, the finished product after the epoxy AB glue reaction needs to be put in 20-40 heating or wood drying room, after more than 24 hours, in order to ensure that the resin hardening reaction reaches more than 70%, and to achieve 100% complete reaction must be at the standard room temperature (25) for more than 72 hours.

2) 0-15 can epoxy AB glue, good fluidity at low temperature, easy to operate, good strength.

First of all, in the use of glue, it is recommended that the manufacturer can put the main agent and curing agent of epoxy resin glue into an iron drum, and dig a hole in the lid of the barrel, or hang an incandescent lamp in the iron drum to maintain a constant temperature of 25-30 in the barrel. When the glue is used at low temperatures, the curing time will be extended to the next day. Because in this way, the problem of epoxy resin glue not drying due to the low ambient temperature can be solved.

Secondly, the temperature of the working environment and the materials that need to be worked (such as plates, sheets, core boards, etc.) should not be lower than 10, and they must be heated up before use to increase to a working temperature.