What are the main steps of chip packaging?

The main functions of chip packaging can be summarized as follows: (1) Transmitting electrical energy. All electronic products are powered by electricity, and the transmission of electrical energy includes the distribution sensitivity and conduction of the power supply voltage, and the main consideration for power transfer in the packaging process is to properly distribute the different sizes of voltages required by devices and modules in different parts to avoid unnecessary electrical loss, and at the same time consider the distribution of ground wires.

The transmission of electrical energy must be realized through the connection of lines, which is the main function of chip packaging. (2) Transmit electrical signals. The electrical signals generated by the integrated circuits or the electrical signals from external inputs need to be encapsulated to transmit the lines between the different layers to the correct position, and these lines must not only ensure that the delay of the electrical signal is as small as possible, but also ensure that the transmission path is the shortest.

Therefore, after the wires are connected through the chip package, the electrical signal transmission between the various electronic components is both effective and efficient. (3) Heat dissipation. The components, components, and modules of integrated circuits will generate a certain amount of heat when they work for a long time.

Chip packaging is to use the good thermal conductivity of the packaging material to effectively dissipate the heat generated between the circuits, so that the chip can work normally at the appropriate working temperature and meet the requirements of various performance indicators, so that the circuit will not be damaged due to the accumulation of too high temperature in the working environment. (4) Circuit protection. Effective circuit protection requires not only reliable mechanical support for the bridge between the chip and other connecting components, but also to ensure that the delicate integrated circuits are not contaminated by external substances.

The chip package provides good structural protection and support for the stability and reliability of integrated circuits. (5) System integration. The scientific packaging process not only reduces the number of solder joints connected between the circuits, but also significantly reduces the volume and weight of the package, and shortens the connection lines between the components, which improves the electrical performance of the integrated circuit as a whole.

The packaging process of integrated circuits (ICs) generally refers to the process of encapsulating bare dies with protective materials and forming electrical connections. The first part of the packaging process consists of the following steps:

Selection of appropriate packaging form and encapsulation material;

Design the package structure, including chip placement, pin layout, package size, etc.;

Make encapsulation molds, usually made of metal or plastic materials;

To make leads, copper wires or gold wires are generally used, and they are assembled to the mold by automatic placement machinery;

Placing the die and putting the die into the packaging mold is usually done by using an automatic aging machine;

Soldering, in which the lead wire is soldered to the metallized electrode of the bare die, generally using hot pressure soldering or wire soldering processes.

The above are the first steps of the packaging process, after the completion of these steps, you can carry out the back testing, packaging and transportation steps, and the brightest rock will finally deliver the IC products to the customer.

Your question is very vague, first of all, there are many types of chips, such as CPU, GPU, North-South Bridge, and other EPUs, VPUs, and so on. And the encapsulation you mentioned, which is very unspecific. So, as far as your question is concerned, I basically don't know how to answer it.

Lou Zhu made it clear, the packaging of the chip!

Step 1: Crystal expansion. The dilator is used to evenly expand the entire LED wafer film provided by the manufacturer, so that the LED grains that are tightly arranged on the surface of the film are pulled apart, which is convenient for piercing the crystal.

Step 2: Adhesive backing. Place the expanded crystal expansion ring on the adhesive machine surface of the scraped silver paste layer, and put the silver paste on the back. Dotted silver paste. Suitable for bulk LED chips. A dispensing machine is used to dot an appropriate amount of silver paste on the PCB printed circuit board.

Step 3: Put the expanded crystal ring of the prepared silver paste into the spinning frame, and the operator will pierce the LED wafer on the PCB printed circuit board with a spinning pen under the microscope.

Step 4: Put the PCB printed circuit board into the thermal circulation oven at a constant temperature for a period of time, and take it out after the silver paste is cured (not for a long time, otherwise the LED chip coating will be yellowed, that is, oxidized, which will cause difficulties to bonding). If there is an LED chip bonding, the above steps are required; If only the IC chip is bonded, the above steps are cancelled.

Step 5: Glue the chip. Use a dispensing machine to put an appropriate amount of red glue (or black glue) on the IC position of the PCB printed circuit board, and then use an anti-static device (vacuum suction pen or sub) to correctly place the IC bare chip on the red glue or black glue.

Step 6: Drying. Put the glued bare die into a hot circulation oven and place it on a large flat heating plate at a constant temperature for a period of time, or it can be cured naturally (for a longer time).

Step 7: Bonding (Bonding). An aluminum wire bonding machine is used to bridge the wafer (LED die or IC chip) with the corresponding pad aluminum wire on the PCB board, that is, the inner lead of the COB is soldered.

Step 8: Pre-test. Use special testing tools (there are different equipment according to different COBs for different purposes, the simple one is a high-precision regulated power supply) to test the COB board, and the unqualified board is repaired.

Step 9: Dispensing. The dispensing machine is used to point the appropriate amount of the prepared AB glue to the bonded LED die, and the IC is encapsulated with vinyl, and then the appearance is encapsulated according to the customer's requirements.

Step 10: Curing. Put the sealed PCB printed circuit board into the thermal circulation oven at a constant temperature, and different drying times can be set according to the requirements.

Step 11: Post-test. The packaged PCB printed circuit board is then tested for electrical performance with special testing tools to distinguish the good from the bad.

LED Package Introduction:

1.Crystal expansion, the arrangement of dense wafers to make a little easier to bond,2.Die bonding, 3Short roast.

4.Wire bonding. 5.Pretest.

6.Glue potting. 7.Long roast.

8.Post-test. 9.Spectroscopy and color separation.

10 packing.

LED packaging steps, 1, crystal expansion, 2Die bonding. 3. Short roast. 4.Wire bonding, 5, pretest, 6Glue potting, 7Long roast. 8, post-test, 9Spectroscopy and color separation. 10.Wrap.