There are several temperature zones for reflow soldering, and what is the temperature and time of ea

Reflow soldering. On the whole, there are only four major temperature zones: preheating zone, constant temperature zone, reflow welding zone and cooling zone. No matter how many temperature zones reflow soldering has, their temperature settings are set according to the principle of action of these four temperature zones.

There are generally more eight-temperature zone reflow soldering on the market.

180 degrees; Temperature zone 3: 183 degrees; Temperature zone 4: 168 degrees; Temperature Zone Five:

174 degrees; Temperature zone 6: 198 degrees; Temperature zone 7: 240 degrees; Temperature Zone Eight:

252 degrees; Shipping speed:; The over-temperature alarm is set to 10 degrees.

The workflow of reflow soldering is:

1. When the PCB enters the heating zone, the solvent and gas in the solder paste evaporate, and at the same time, the flux in the solder paste wets the pad.

Component ends and pins, solder paste soften, collapses, covers the pads, and will the pads.

2. When the PCB enters the insulation area, the PCB and components should be fully preheated to prevent the PCB from suddenly entering the soldering high temperature area and damaging the PCB and components.

Reflow soldering is generally divided into eight-temperature zone reflow soldering, ten-temperature zone reflow soldering, and twelve-temperature zone reflow soldering; Now the reflow soldering is generally lead-free hot air type, the above are computer operation, on the computer, there is a temperature curve, recording the temperature and time of each temperature zone when the reflow soldering runs, the landlord can understand the basic situation of each temperature zone by looking at the temperature curve chart.

The specific temperature zones should be determined according to your own purchase, the more temperature zones, the better the temperature curve is controlled, the temperature and time are also uncertain, different solder paste requirements are different, which should be determined according to your actual product

Take 12-temperature zone reflow soldering as an example:

1.Preheating area: PCB and material (components) preheating, for the reflow oven is the heating effect of the first one to two heating intervals Higher preheating, so that the soldered material reaches thermal equilibrium, the solder paste begins to move, and the flux and other components are affected by the temperature rise and begin to volatilize appropriately, which is the heating effect of the third to fourth heating interval for the reflow oven

2.Constant temperature zone: Removing the oxide on the surface, some of the gas flow begins to evaporate (start welding) and the temperature reaches the melting point of the solder paste (at this time, the solder paste is in the state of dissolving but not dissolving), which is the heating effect of the fifth, sixth and seventh heating intervals for the reflow oven

3.Soldering zone: from the melting point of the solder to the peak and then to the melting point, the process of solder melting, the pad and the solder form a weld, which is the first for the reflow oven.

Eighth, ninth, tenth, three plus interval heating

4.Cooling zone: from the melting point of the solder to about 50 degrees, the formation process of alloy solder joints, which is the first for reflow ovens.

Ten. 1. The cooling effect of the two cooling intervals

According to the climb curve setting, the reflow soldering temperature can be adjusted from room temperature to 300. Generally, such as 180-195-220-230 on the top four and four on the bottom

6 temperature zone words.

180-190-200-210-220-2308 temperature zone.

The operation method of the 10-temperature zone reflow soldering temperature setting chain dust is as follows:

1. Turn on the power and rotate the black handle from OFF to ON position.

2. First turn on the power of the computer, then rotate the green switch to the ON position, pause for 5 seconds, and the reflow soldering will turn on.

3. In manual mode, click Start, Transport, Fan, and Heating in turn, and operate in the direction of the arrow.

4. Open the file and select the required program, then click OK, wait for the furnace temperature to be normal (PV=SP), that is: the indicator light is green, and the temperature test will be carried out in the shed.

5. When the furnace temperature is lower than 100 degrees, it will automatically shut down, manually close the Huai Huai and close the process: click on the heating, fan, transportation, then turn off the computer program and finally turn off the power switch. <>

1. There are several temperature zones in the reflow oven.

2. How many temperature zones does the reflow oven have?

3. The temperature of the four temperature zones of the reflow furnace.

4. The role of each temperature zone of reflow soldering.

1.Heating zone: preheat and heat the PCB board, activate the solder paste, volatilize a part of the solvent, and evaporate the water of the PCB board and components to eliminate the stress in the PCB board.

2.Holding area: The PCB board enters the insulation area and reaches a certain temperature to prevent it from suddenly entering the soldering high temperature area and damaging the PCB board and components.

3.Keep the temperature of the components stable, so that the temperature of the different sizes of components on the PCB board is maintained all the time.

1. The function of the reflow soldering heating zone: the heating zone is in the first stage of reflow soldering machine soldering, preheating and heating the PCB board, activating the solder paste, volatilizing a part of the solvent, and evaporating the water of the PCB board and components to eliminate the stress in the PCB board.

2. The function of the reflow soldering insulation area: the PCB board enters the insulation area and reaches a certain temperature to prevent the sudden entry and dismantling of the soldering high temperature area and damage the PCB board and components. The function of this temperature zone is also to keep the temperature of the components stable, so that the temperature of the different sizes of components on the PCB board is constant, reduce the temperature difference of the entire PCB board, and volatilize the flux in the solder paste, removing oxides from the pads and component pins.

3. The role of the silver crack reflow soldering area: the PCB board enters the soldering area, and the temperature reaches the highest, at this time, the solder paste has changed from paste to liquid, fully infiltrating the pad and component pins, and the duration of this link is relatively short to prevent high temperature damage to the PCB board and components.

4. The role of the reflow soldering cooling zone: after the solder paste becomes liquid, it can be cooled next, the faster the cooling speed, the better, the cooling speed is too slow, the front is easy to produce gray roughness, generally cooled to 75 on the cure, then the soldering of the PCB board is realized.