How to remove the two panel IC on the circuit board with an electric soldering iron?

Thread a thin copper wire into the IC pins, melt the tin, and pull the copper wire out from under the pins.

A No. 16 medical injection steel needle (sold in the electronic market or pharmaceutical store), melt each pin of the IC on the circuit board with an electric soldering iron, and use the No. 16 medical injection pinhole to cover the IC pin and rotate, so that the IC pin is separated from the circuit board, and it is easy to take it off by hand after the IC pin is all separated. I've been doing this for decades.

There are dedicated heat guns, which are like a shoebox in size. When using, blow the IC solder part with hot air and gently remove the IC with tweezers. Note that the heating time should not be too long, and the solder can be melted to avoid damaging the components.

If you occasionally encounter this situation on a single-sided circuit board, there are also tips: use multiple strands of thin wire copper wire to glue rosin, and when you melt the solder with an ordinary electric soldering iron, immediately use it to dip away the melted solder, and repeat it several times to absorb it. You can also use a soldering iron.

Circuit board (printed

circuit

Board, referred to as PCB), also known as circuit boards, PCB boards, aluminum substrates, high-frequency boards, ultra-thin circuit boards, ultra-thin circuit boards, printed (copper etching technology) circuit boards, etc. The circuit board is mainly composed of pads, vias, mounting holes, wires, components, connectors, fillers, electrical boundaries, etc. Common laminate structures include single-laminate (single

layerPCB), double

layerPCB) and multilayer boards (Multi

layerPCB).

Bend the copper plate into a section of channel steel type copper work, the width is just less than the width of the chip pins, put it in the middle of the two rows of pins, and heat the groove copper work with an electric soldering iron, and remove this IC while it is hot. Of course, the soldering iron should not be too small, and the place of contact with the soldering iron and with.

The pins should also be soldered with tin. (The red in the picture is copper, and the black is the pin).

It is difficult to use a soldering iron to disassemble a chip in a dip package, and some tools are needed to do it:

1.The kind of special soldering iron tip in the recommended answer, he has already introduced it in detail, so I won't say more.

2.A solder extractor can be used to suck up excess solder from the pads, but it is still a little difficult to disassemble the chip with it.

3.The hollow needle, which can be modified with a syringe needle, and the finished set hollow needle, which is used to isolate the component pins from the pads, is made of steel and cannot be soldered. This is a relatively powerful tool, which can be used only with an electric soldering iron to remove the chip in the DIP40 package.

4.Copper braided mesh, which has the same function as a solder absorber.

463533703 method is the fastest and best to use, attention and heating time, otherwise it is easy to pull up the copper foil of the circuit board.

There is a simple way, add a lot of tin on the side of the IC, use tweezers to warp the test of the IC and add tin, the soldering iron quickly crosses, let the tin melt, and you can easily warp one side. The other side is the same. The difficulty coefficient is 5 stars.

Pay attention to the strength, and the heating time. You must practice, otherwise how will you mix in the future.

DIP packaged: 1, with solder suction 2Suction tin rope, 3 quick heating with a tool to pry down. Patch is.

Remove with a blade for quick heating.

Long, large chip sockets are best not to be disassembled, which are easy to break.