What is the role of LED lighting packaging, and what is the detailed process of LED packaging?

Many people say that it is a chip, in fact, many people say that the chip, in fact, is to reduce costs, the core of LED lighting technology lies in the packaging, this is a technical job, the packaging is not valuable, but the quality of the packaging directly affects the luminous efficiency and luminous life of the LED lamp. How to package the chip, conducive to heat dissipation, the junction temperature is controlled below 58 °C, in order to better extend the service life of LED lights, domestic BYD, they not only make their own chips, but also invest a lot in the research of packaging, mainland manufacturers have begun to increase the research of all aspects of the technology.

It is necessary to encapsulate first, and then talk about the application.

In general, the function of the package is mainly to protect the die and complete the electrical interconnection, while the LED package is to complete the output electrical signal and protect the normal operation of the die. The packaging technology is complex, and only the packaged LEDs can become the end product.

The core chip, chip technology in foreign countries, the current chip accounts for 60-70% of the entire cost, packaging is of course also important, but it is still an application level problem, you have to fry eggs, eggs are someone else's.

The question you asked is not specific and bad, the LED light should be said to be the application of this piece, and some of the lamp beads in it can be said to be encapsulated which piece.

I just know that if the front is not done well, then the back will definitely not be good.

It's big, it's big, the problem needs to be more detailed, or I don't know how.

Roughly the process is like this, first of all, the dispensing of the LED bracket is carried out, and after the dispensing, the wafer (wafer) is reinforced, and there is a baking after the reinforcement, and a silicone package is carried out!!

Die bonding - wire bonding - glue filling (molding) - cutting (separation) - spectroscopy - packaging - warehousing die bonding is commonly said to use solid crystal glue (silver glue, insulating glue) to glue the chip to the bracket, and then bake the glue dry, enter the next process.

The wire bonding is to use gold wire to connect the positive and negative electrodes on the chip with the bracket and pour glue, also known as dispensing, which is to use glue (epoxy glue, silicone gel) to point into the cup mouth, and then bake.

Molding) is mainly for PCB sheets, cutting (separation).

It is to divide the materials into pieces.

According to the needs of the customer, the spectroscopy separates the color temperature that the customer wants.

Packing is split into tape packing, and bulk packing (packing money material dehumidification).

The warehousing is labeled accordingly and flows into the warehouse.

There is a more detailed process in this library, you can take a look.

This one contains information about the packaging factory, and you can also refer to it.

Basic process: crystal expansion, die bonding, welding, packaging, light splitting, packaging.

Pin package.

Surface-mount package.

Power package.

Cob type package.

Inspection of raw materials - die bonding - wire bonding - sealing - short roasting - long roasting - pre-cutting - testing - post-cutting - splitting - packaging, Sophie Electronic Technology specializes in production.

There are many kinds, and the specific ways to distinguish them can be divided into many kinds according to the package shape, medium, etc.