LED production process 30

LED production process:

One. Row brackets.

Front station: crystal expansion.

1.Temperature: Adjust 50-60 degrees Celsius Preheat for 10 degrees The temperature is set to 65-75 degrees Celsius during crystal expansion.

2.Remove the glue from the refrigerator, thaw for 30 minutes, and stir well (20-30 minutes) after thawing safely

3.The height of the silver glue is below 1 3 and above 1 4 after the height of the wafer, and the eccentricity distance is less than 1 3 of the diameter of the wafer

Three. Die bonding. 1.The die bonding pen is kept at 30-45 degrees Celsius with the die bonding plane. Press your index finger to the top of the nib.

2.The die bonding order is from top to bottom, from left to right.

3.Use a die bonding pen to glue the crystal to the center of the bracket and wrist insulating glue.

Four. Solid crystal baking.

1.Roast at 150 degrees Celsius.

After hours, roast.

Five. Generally, the defective products of die bonding are:

Solid deception Solid leakage Solid oblique Less glue Polycrystalline Chip damage Short pad (electrode falling off) Chip flipping Silver glue height exceeds 1 3 (multi-glue) Wafer adhesive.

Solder joint adhesive. Six. Wire bonding.

1.The temperature is 170-220 degrees Celsius.

Single wire: 220 degrees Double wire: 180 degrees.

2.Wire tensile force 715g

3.The arc of the wire bond is higher than the height of the wafer and less than 3 times the height of the wafer.

4.The global diameter of the solder joint is 2-3 times the diameter of the whole line. Solder joints should be applied on 2 to 3 electrodes.

Note: General defective wire bonding products: wafer damage, crystal dropping, crystal dropping, electrode crossing, wafer flipping, electrode adhesive, too much silver glue more than the wafer, too little silver glue (almost none), collapsed line, virtual soldering, dead line, welding reverse line, missing soldering, high and low arc, broken wire, too large or small in the world.

For detection methods, please refer to.

That's a good write-up.

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LED bulbs are often used in our daily life, which are not only environmentally friendly, low energy consumption, but also have a long service life and are durable. Many people want to make LED lights by themselves, but the production process is not very clear, so today I will explain the LED light production process and precautions for your reference.

First, the production process of LED lights.

1. 1 pair of needle-nose pliers or diagonal pliers, temperature regulating electric soldering iron with grounding wire, anti-static bracelet, nail clippers, high-quality fine solder wire, high-quality rosin, AB glue, preferably a DC ammeter of 50mA.

2. The LED should be high-brightness, the astigmatism should be brighter than 1200mcd, the angle should be 120 degrees, and the concentrating type should be brighter than 20000mcd. Voltage and current 20mAGenerally, the legs of LEDs are very long, in order to facilitate soldering, use needle-nose pliers or diagonal pliers to pre-cut the pins and leave 3mm pins.

3. Put the circuit board mounting side up, put the LED polarity direction, pay attention to the long leg is the positive pole, the short leg is the negative pole, the straw hat brim has a flat negative pole, and the round side is the positive pole.

4. After installing the LED, the circuit board soldering side up can be soldered, soldering should be done with a 30W soldering iron and grounding wire, the soldering temperature is controlled within 240 degrees, and the time can not exceed 2 seconds. After soldering, use nail clippers to trim off the pins. In this way, the light board is assembled.

5. Next, the power supply should be assembled, and the welding of the power supply is simpler and the welding is successful, as shown in the figure below, because the space in the lamp cup is limited, and the components should be sorted out to reduce the volume and facilitate installation.

6. After the power supply and the lamp board are welded, the wiring test can be carried out. The test current is 14mA, which can meet the requirements. Take care to insulate the power supply.

7. Finally, it is assembled, and the power board and lamp board are loaded into the edge of the lamp cup with the matching AB glue diagram, and the glue is cured for a few minutes. Such a practical LED energy-saving lamp is ready to use when it is ready.

2. Precautions for the production of LED lights.

Because LED is very sensitive to static electricity, static electricity is easy to cause damage to LED, the performance will be reduced, and the LED will cause a short circuit in the car hole, so when contacting LED, we must do a good job of static protection, wear an anti-static bracelet, use an anti-static soldering iron, and the ordinary soldering iron must be grounded. Conditionally, anti-static mats are also required.

After the explanation, I believe that we have a certain understanding of the LED lamp production process, in fact, the LED lamp production process is not very difficult, you can follow the explanation step by step, and soon master the method of self-made LED lights, after learning to decorate the home by yourself, which is environmentally friendly and economical. Socks withered.

It depends on which production link you pay attention to, whether it is a lamp bead, a chip, a driving power supply, or a post-assembly...

First of all, it consists of bracket + chip (core part) + silver glue + lens (auxiliary: gold wire; phosphor) encapsulated into lamp beads (LED light source). Then put the lamp beads on the aluminum substrate (if it is reflow soldered, use silicone lamp beads), and install the light source jacket, such as (light bar and bulb shell), and you can do it.

In the automatic assembly production line of LED bulbs, it involves feeding, reclaiming, gluing, fastening, boarding, screwing, lampshade crimping, etc

A series of processes such as internal lighting measurement and volume test, the object of these actions and the mode of action will be difficult to achieve on automation equipment if according to the current manual-based process, so it is necessary to redesign the relevant assembly process and decompose it into appropriate multi-step steps, so that it can match with the automatic production line.

Step 1: Crystal expansion. The dilator is used to evenly expand the entire LED wafer film provided by the manufacturer, so that the LED grains that are tightly arranged on the surface of the film are pulled apart, which is convenient for piercing the crystal.

Step 2: Adhesive backing. Place the expanded crystal expansion ring on the adhesive machine surface of the scraped silver paste layer, and put the silver paste on the back. Dotted silver paste. Suitable for bulk LED chips. A dispensing machine is used to dot an appropriate amount of silver paste on the PCB printed circuit board.

Step 3: Put the expanded crystal ring of the prepared silver paste into the spinning frame, and the operator will pierce the LED wafer on the PCB printed circuit board with a spinning pen under the microscope.

Step 4: Put the PCB printed circuit board into the thermal circulation oven at a constant temperature for a period of time, and take it out after the silver paste is cured (not for a long time, otherwise the LED chip coating will be yellowed, that is, oxidized, which will cause difficulties to bonding). If there is an LED chip bonding, the above steps are required; If only the IC chip is bonded, the above steps are cancelled.

Step 5: Glue the chip. Use a dispensing machine to put an appropriate amount of red glue (or black glue) on the IC position of the PCB printed circuit board, and then use an anti-static device (vacuum suction pen or sub) to correctly place the IC bare chip on the red glue or black glue.

Step 6: Drying. Put the glued bare die into a hot circulation oven and place it on a large flat heating plate at a constant temperature for a period of time, or it can be cured naturally (for a longer time).

Step 7: Bonding (Bonding). An aluminum wire bonding machine is used to bridge the wafer (LED die or IC chip) with the corresponding pad aluminum wire on the PCB board, that is, the inner lead of the COB is soldered.

Step 8: Pre-test. Use special testing tools (there are different equipment according to different COBs for different purposes, the simple one is a high-precision regulated power supply) to test the COB board, and the unqualified board is repaired.

Step 9: Dispensing. The dispensing machine is used to point the appropriate amount of the prepared AB glue to the bonded LED die, and the IC is encapsulated with vinyl, and then the appearance is encapsulated according to the customer's requirements.

Step 10: Curing. Put the sealed PCB printed circuit board into the thermal circulation oven at a constant temperature, and different drying times can be set according to the requirements.

Step 11: Post-test. The packaged PCB printed circuit board is then tested for electrical performance with special testing tools to distinguish the good from the bad.

It's hard to say, just let you take a look.