PCB board manufacturing steps, PCB board manufacturing process

The manufacturing steps of a PCB board usually include the following main stages:

1.Design circuit diagram: Use electronic design software to design circuit diagram according to circuit requirements and specifications, including component selection and connection methods.

2.PCB layout design: Based on the circuit diagram, PCB design software is used to design the PCB layout. This includes determining the size of the board, the number of layers, the pin layout, the routing plan, and the circuit connections.

3.Component selection and procurement: According to the PCB layout design required component parameters and specifications, component selection and procurement of required components.

4.Printing production: design and make the negative according to the PCB layout, then coat the copper plate with a light sensitive agent, and place the negative on the copper plate to position, through the steps of ** and development, form patterns and wires.

5.Electroplating: A photosensitive copper plate is placed into an electroplating bath, and a layer of target metal of moderate thickness, such as tin or gold, is plated on the copper surface through electrolysis.

6.Etching: A corrosive agent is used to etch away the copper plate that is not covered with the photosensitive film, leaving only the PCB pattern and wires.

7.Cleaning and film removal: Clean the surface of the PCB board to remove residues such as corrosive agents and photosensitive films.

8.Drilling: Use a drilling machine to fix the position of the PCB board according to the design requirements, and punch holes to form connecting holes on the circuit board.

9.Soldering components: According to the position of the components corresponding to the PCB layout, the components can be welded, which can be soldered manually or automatically by machine.

10.Test and Inspection: Test and inspect the soldered circuit board to ensure that the components and circuits are connected properly.

11.Assembly and commissioning: According to the design requirements, the PCB board is installed into the corresponding equipment or product, and the preliminary debugging and functional verification are carried out.

The above steps are common for PCB boards.

The production process, the specific process and details may vary in the actual production, and can also be adjusted and optimized according to specific requirements. In addition, in order to ensure good quality control, it is necessary to follow the relevant standards and norms.

The main steps of PCB board production are: 1. Circuit schematic diagram design, 2. PCB board diagram (component location, connection diagram) design, 3. Copy PCB board diagram on PCB board, 4. Photolithography, corrosion, rinsing, 6. Component soldering and assembly, 7. Debugging.

In today's society, electronic technology is highly developed, electronic products exist everywhere, electronic products have circuit boards, he is the carrier or core part of electronic products, today I will talk to you, the production process of circuit boards.

First of all, design the schematic diagram according to the requirements of the project, that is, how to go the line, which electronic components to use, etc.

The next step is to use circuit diagram software, such as Protel or Pads and other software, to draw the PCB board according to the schematic, and the drawing board is actually to package and discharge these components and connect them online.

The next step is to give the drawings to the PCB manufacturer, who first cut a large piece of board into small pieces that meet the requirements according to the size of the circuit board.

Punching holes, that is, some screw holes, some fixed mounting holes, etc.

After the processes of copper immersion, electroplating, stripping, etching, green oil, silk screen printing characters, molding, testing, etc., you can get a PCB board.

The board is received and the various components are soldered according to the schematic, so that the final board is completed.

The secret of the process - the PCB manufacturing process.

1. Layout design.

When designing how to place special components, the PCB size is the first consideration. Kuaiyigou pointed out that when the PCB size is too large, the printing line is long, the impedance increases, the drying resistance decreases, and the cost also increases; If it is too small, the heat dissipation is not good, and the adjacent lines are easy to be disturbed. After determining the size of the PCB, determine the pendulum position of the special components.

Finally, according to the functional unit, all the components of the circuit are laid out.

2. Placement order.

Place components that fit closely with the structure, such as power sockets, indicators, switches, connectors, etc. Place special components, such as large components, heavy components, heating components, transformers, ICs, etc. Place small components.

3. Layout check.

Whether the size of the circuit board is consistent with the processing size required by the drawing. Whether the layout of the components is balanced, neatly arranged, and whether they have been fully arranged. There is no conflict at all levels.

For example, whether the components, frames, and layers that need to be privately printed are reasonable. Whether the commonly used components are easy to use. Such as switches, plug-in board insertion equipment, components that need to be replaced frequently, etc.

Whether the distance between the thermal component and the heating component is reasonable. Whether the heat dissipation is good. Whether the interference problem of the line needs to be considered.