What is Laser Perforation? Why can t laser punching process deep holes?

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It is the focus of a laser light into tiny dots of light on the micron or submicron scale, which shine on the cell and open a small hole in the cell. This small hole closes automatically in less than a second. Biologists immerse the cells in a medium containing genetic material and then target the cells with a laser beam to make a small hole in the cells.

Gene material flows into the cell through the pores to complete the direct transfer of genes. The hole then closes itself and returns to its original state, becoming a cell carrying the new gene. In this way, the process of "grafting" the genetic material is completed.

Japan's Sambola Brewery and Hitachi Manufacturing have successfully injected foreign genes into barley cells with cell walls using this technology. They used a laser to punch holes in the cell wall, cell membrane, and nuclear membrane at the same time, and the genes in the culture medium were injected into the cells from this hole. Genes are injected with this method, and tens of thousands of cells are processed within 30 to 40 minutes.

Summary. It is mainly due to non-contact thermal decomposition and thermal expansion peeling that cannot be processed.

It is mainly due to non-contact thermal decomposition and thermal expansion peeling that cannot be processed.

Depending on what kind of material, the process requirements of the deep hole wall of the workpiece, laser processing is characterized by non-contact thermal decomposition and thermal expansion peeling, and the smoke and waste residue generated in the processing process affect the irradiation state of the laser, and the laser operation mode is divided into pulsed light and continuous light, and different materials and processing processes should choose the appropriate wavelength and pulse width of the laser.

Can lasers process mirror and transparent materials? Please briefly explain the reasons and propose a solution.

What are the similarities and differences between laser processing, electron beam processing, and ion beam processing?

3.Processing characteristics: electron beam:

1.Small beam diameter and high energy density; (2) Non-contact processing, there is no obvious mechanical cutting force between the tool and the processed workpiece during the processing process, and there should be no macroscopic stress and deformation: (3) The range of processed objects is wide

4）.The electron beam has high energy, fast processing speed and high efficiency: (5) The electron beam processing is expensive with special equipment and vacuum system.

Ion East: (1).High machining accuracy and surface quality:

2）.Wide range of processing materials: (3) Rich processing methods:

4）.Good performance, easy to achieve automation: (5) The application range is wide, and the laser beam can be selected according to the processing requirements

1）.High machining accuracy: (2).

Wide range of processed materials (3).Good processability: (4).

Fast processing speed and high efficiency: (5).**Expensive processing methods:

Electron beam: (1).Electron beam scanning**:

2) Electron beam surface modification :(3) Electron beam surface modification.

The punching formula is as follows:

Ral(8 ) +1 Shul (10) +1 Perfect Sapphire Normal Helmet The same type of helmet with grooves.

Tal (7) + 1 Amp (11) + 1 Perfect Ruby Regular Shields The same type of shield with grooves.

Ral (8) + 1 Amp (11) + 1 Perfect Purple Gem Normal** The same type has grooves**.

Tal (7) + 1 Shul (10) + 1 Perfect Topaz Normal armor The same type of armor with grooves.

Flawless Gems 1 Magic** Grooved Magic**.

Maces** include:

1. Club, hammer, mace, flail, scepter, club.

2. Wooden clubs (clubs) spiked clubs (spiked clubs) and their superior essence of hammers (hammers).

3. War hammer (maul) greatest maul and their superior essence version.

4. Mace includes Mace, Morning Star, Flail and their superior versions, excluding other types of Mace and Scepter.

5. Scepter Grand Scepter War Scepter and their superior essence version.

Are you galvanometer punching or optical path output? Do you have XY rails for this?

Laser punching machine is the earliest laser processing technology to reach practical use, and it is also one of the main application fields of laser processing. With the rapid development of modern industry and science and technology, more and more materials with high hardness and high melting point are used, and traditional processing methods can no longer meet some process needs. Punching with a laser is not difficult to achieve.

The high concentration of the laser beam in space and time allows the spot diameter to be reduced to the micron level to achieve a high power density, allowing laser perforation of almost any material.

The working principle of the laser punching machine

1) When the laser working material yttrium aluminum garnet is excited by the bridge lift of the light pump (excitation pulse xenon lamp), it absorbs light with a specific wavelength, which can cause the number of metastable particles in the working substance to be greater than the number of particles at the lower energy level under certain conditions, this phenomenon is called particle number reversal. Once a small number of excited particles produce a stimulated radiation transition, the light will be amplified, and then the oscillation will be generated by the feedback of the total mirror and some mirrors in the resonator, and finally the laser will be output by one end of the resonator. The laser is focused through the lens to form a high-energy beam that is irradiated on the surface of the workpiece, and the processing can be carried out.

2) The electrical system includes the power supply to the laser and the control system that controls the laser output mode (pulsed or continuous, etc.). In the latter, an automatic control device that drives the table according to the processing requirements is also sometimes included.

3) The function of the optical system is to precisely focus the laser beam on the processing part of the workpiece. For this purpose, it contains at least two parts: a laser focusing device and an observation and sighting device.

4) The projection system is used to display the back of the workpiece, which is equipped in a relatively complete laser beam punching machine.

5) The worktable is controlled by manual control or numerical control device, and moves in the three-coordinate direction, which is convenient and accurate to adjust the position of the workpiece. The shed countertop in the workbench is made of glass, as the opaque metal countertop is inconvenient for inspection and can be damaged if the workpiece is punched through. There is a suction and blowing device under the focusing objective above the table to keep the work surface and the focusing objective clean.

Application of laser punching machine

Laser perforation is mainly used in aerospace, automobile manufacturing, electronic instrumentation, chemical and other industries. The rapid development of laser perforation is mainly reflected in the fact that the average output power of the YAG laser for perforation has increased from 400W five years ago to 800W to 1000W. At present, the application of laser perforation is relatively mature in the production of synthetic diamond and natural diamond wire drawing dies and the production of gemstone bearings for clocks and instruments, aircraft blades, multi-layer printed circuit boards and other industries.

At present, most of the lasers used are YAG lasers and CO2 lasers, but there are also some excimer lasers, isotope lasers and diode-pumped lasers.

You can get it for free

How big the hole can be made by the laser punching machine depends on the roundness of the hole, the inner wall, the tolerance, etc., 1mm, if these requirements are very high, the minimum can be adjusted by 50 microns, but the cost of making one is very large. If high power is used, the quality of the hole is not required (e.g. penetration) is not high, and the cost is very low. If there is no requirement for taper, the minimum can be within 30 microns.

If the material is thinner, the pore size can theoretically be a few microns, but it is generally of little significance.

1) High perforation efficiency and good economic benefits.

2) Large depth-to-diameter ratios can be obtained.

3) It can be carried out on various materials such as hard, brittle, and soft.

4) No tool loss.

5) It is suitable for the processing of large number and high density group holes.

6) Small holes can be made on the inclined surface of materials that are difficult to process.

I can do holes on my side. Shandong Linyi Fuda Laser.

It mainly depends on what material you want to play, if it is leather, cloth, the domestic machine can play up to 1600mm*1600mm. If it is metal, it can be up to 500mm*500m.

Yes, the laser marking machine can not only mark logos, trademarks, patterns and patterns on the surface of the product, but also punch, hollow, cut, etc.

It is necessary to look at the material and thickness, as well as the evaluation of the effect.

If you don't have high requirements for results, it's okay, and of course the efficiency will be low. The prerequisite for this is that your material can be absorbed by the wavelength of the laser marker and is suitable for the job.

Yes, the laser power can meet the requirements of punching through the workpiece.

The principle of laser cutting, laser engraving, and laser marking is the same, and the processing effect - how much area the laser irradiates, how deep the burning, etc., is related to the laser power.

Professional equipment to do professional things, punching or laser cutting machine is better!