The performance requirements of ceramic substrates, the properties of wood based ceramic materials a

1) Mechanical properties.

It has high enough mechanical strength to be used as a supporting component in addition to the carrying element; Good machinability and high dimensional accuracy; Easy to achieve multi-layering;

The surface is smooth, without warping, bending, micro-cracks, etc.

2) Electrical properties.

High insulation resistance and insulation failure voltage;

Low dielectric constant;

Low dielectric loss;

Stable performance under high temperature and high humidity conditions ensures reliability.

3) Thermal properties.

High thermal conductivity; The coefficient of thermal expansion should be matched to the material in question (in particular, the coefficient of thermal expansion of Si should be matched);

Excellent heat resistance.

4) Other properties.

Good chemical stability; It is easy to metallize, and the circuit pattern has strong adhesion to it;

Non-hygroscopic; Resistant to oils and chemicals; The amount of a-ray emitted is small;

The substances used are pollution-free and non-toxic; The crystal structure does not change within the operating temperature range;

Abundant raw materials; The technology is mature; Easy to manufacture; **Low.

With its excellent thermal conductivity and stability, ceramic substrate materials are widely used in power electronics, electronic packaging, hybrid microelectronics and multi-chip modules and other fields.

The ceramic substrate has strong mechanical stress and stable shape; High strength, high thermal conductivity, high insulation; Strong adhesion and anti-corrosion; It has excellent thermal cycling performance, with 50,000 cycles and high reliability; Like PCB boards (or IMS substrates), various graphic structures can be etched; No pollution, no pollution. The production process of ceramic substrate products and the product itself are completely environmentally friendly, and after the technical bottleneck and barrier are broken, with the increase in output, it will be greatly reduced, which is the development direction of electronic circuit substrates in the future.

Performance requirements of ceramic substrates:

1.Mechanical properties.

It has high enough mechanical strength to be used as a supporting component in addition to the carrying element; Good machinability and high dimensional accuracy;

2.Electrical properties.

High insulation resistance and insulation failure voltage;

Low dielectric constant;

Low dielectric loss;

Stable performance under high temperature and high humidity conditions ensures reliability.

3.Thermal properties.

High thermal conductivity; The coefficient of thermal expansion should be matched to the material in question (in particular, the coefficient of thermal expansion of Si should be matched);

Excellent heat resistance.

4.Other properties.

Good chemical stability; It is easy to metallize, and the circuit pattern has strong adhesion to it;

Non-hygroscopic; Resistant to oils and chemicals; The amount of a-ray emitted is small;

The substances used are pollution-free and non-toxic; The crystal structure does not change within the operating temperature range;

Summary. Wood has multi-layered, fibrous cytoduct structure and anisotropy, and it is this high porosity structure that creates good rigidity, strength and toughness of wood. Based on the wood materials such as renewable resources wood, a series of wood-based ceramic materials with the integration of structure and function are obtained by using physical, chemical and metallurgical methods to carry out ceramic transformation, which provides a new idea for the structural and functional design of materials.

The research on the manufacturing technology of wood-based ceramic materials is advancing with the times, and inorganic modification can not only be prepared through the ceramic transformation of wood materials"Terracotta", high-temperature firing C type wood-based ceramics, high-temperature reactive infiltration composite S I S ic type wood-based ceramics, and metallized wood-based ceramic materials with network interpenetrating structure can be prepared, which has broad development space and application prospects.

High hardness, high brittleness, low melting point.

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Wood has multi-layered, fibrous cytoduct structure and anisotropy, and it is this high porosity structure that creates good rigidity, strength and toughness of wood. Based on the wood materials such as renewable resources, wood, and the ceramic transformation with the help of physical, chemical and metallurgical methods, a series of wood-based ceramic materials with the integration of structure and function of the stove were obtained, which provided a new idea for the structural and functional design of the materials. The research on the manufacturing technology of wood-based ceramic materials is advancing with the times, and inorganic modification can not only be prepared through the ceramic transformation of wood materials"Terracotta", high-temperature firing C type wood-based ceramics concealment, high-temperature reactivity infiltration into composite S i S ic type wood-based ceramics, and can also prepare metallized wood-based ceramic materials with network interpenetrating structure, etc., which have broad development space and application prospects.

Features of ceramic substrates.

Strong mechanical stress and stable shape; High strength, high thermal conductivity, high insulation; Strong adhesion and anti-corrosion;

Excellent thermal cycling performance with up to 50,000 cycles and high reliability.

Like PCB boards (or IMS substrates), various graphic structures can be etched; No pollution, no pollution.

Wide operating temperature -55 850 ; The coefficient of thermal expansion is close to that of silicon, simplifying the production process of power modules.

Ceramic substrate collapse clump refers to the copper foil directly bonded to the surface (single-sided or double-sided) of alumina (Al2O3) or aluminum nitride (ALN) ceramic substrate at high temperature. The ultra-thin composite substrate made of it has excellent electrical insulation properties, high thermal conductivity, excellent brazing and high adhesion strength, and can etch various patterns like PCB plate leakage, and has a large current-carrying capacity. Therefore, ceramic substrates have become the basic materials for high-power power electronic circuit structure technology and interconnection technology.

Due to the heat dissipation characteristics of ceramic substrates, coupled with the advantages of high heat dissipation, low thermal resistance, long life, withstand voltage, etc., with the improvement of production technology and equipment, the rationalization of products has been accelerated, and then the application fields of LED industry have been expanded, such as indicator lights of household appliances, automobile lights, street lamps and outdoor large kanban. The successful development of ceramic substrates will become a service for indoor lighting and outdoor lighting products, making the future market of the LED industry broader.