What is the difference between LED potting adhesive with a compartment and without a compartment

Many people don't understand silicone, so they say that the whole compartment is a defective product, in fact, because the PC lens and the silicone itself have no adhesion, so the compartment is normal, and there are two ways to do it without a compartment on the market, 1 is to fill with jelly glue, because the jelly glue has a certain adsorption and can be adsorbed together with the lens, so the compartment can not be seen at that time, but there will be a local compartment after a long time, and the jelly glue itself has no hardness too soft, and the expansion coefficient is large. Therefore, in some hot and cold environments, there will be bubbles in the packaging process from the injection hole (such as the early Dow Corning's OE6450 is a good example), this packaging process is derived from the previous optocoupler packaging, but not suitable for imitation lumen filling process, 2 use the primer (lens cleaning agent) of the electronics industry as the third medium to bond the PC lens and silica gel together, but the primer in the electronics industry can not be used for optics because it is not resistant to high positions, and has a great impact on light decay, and this primer is also used in LED packaging abroad. But not in the illuminated area only for the bottom of the bracket. Therefore, it is recommended to use a fully spaced package to ensure stability and quality.

I heard from my colleagues that this situation occurs when I go back to the court, as for the reason, I don't know much about this industry, if you have any questions, you can continue to ask, I can ask my colleagues to help you answer!

LED potting adhesives generally have the characteristics of high temperature resistance, flame retardant and high thermal conductivity. If it is used for the packaging of LED chips, it needs to have a high refractive index and high light transmittance, which can protect the LED chip and increase the luminous flux of LED.

LED potting compound is an auxiliary material for LED packaging, with high refractive index and high light transmittance, which can protect LED chips and increase LED luminous flux, with small viscosity, easy to degasser, suitable for potting and molding, so that LED has good durability and reliability.

Features:

Two-component condensed room-temperature-curing LED encapsulant with the following benefits:

1. Strong adhesion, the adhesion to PCB circuit boards, electronic components, ABS plastics, etc. is significantly enhanced compared with ordinary potting adhesives;

2. Good fluidity, can be poured to the subtleties;

3. It has better waterproof, moisture-proof and anti-aging performance;

4. Curing at room temperature, good self-effoaming, more convenient to operate and use;

5. Good weather resistance, long-lasting adhesion, rubber elasticity in the range of -60 250, excellent insulation performance.

Typical uses: LED potting compound is widely used in potting protection of high-power electronic components, module power supplies, circuit boards and LEDs. It is especially suitable for potting and sealing module power supplies and circuit boards with high requirements for bonding performance, heat dissipation and temperature resistance.

According to the function, it can be divided into: mechanical protection type, enhanced heat dissipation type and optical control type. The mechanical protection type has the characteristics of low moisture absorption, low stress and aging resistance, which can improve the reliability of LEDs; The enhanced heat dissipation type can reduce the chip junction temperature, which can effectively improve the performance of the LED; The optical control type mainly improves the light transmission efficiency of the LED and optimizes the beam distribution of the LED.

LED potting adhesive can be divided into lighting potting adhesive, display electronic potting adhesive and module potting adhesive according to its use. LED lighting potting adhesives include lamp potting glue, flexible light strip potting glue, hard light strip potting glue and ball gun lamp adhesive sealant.

In addition to the potting protection of general electrical modules, LED display electronic potting adhesive also has the functions of insulation, waterproofing and fixing. LED module potting compound refers to a type of rubber material that cures several LEDs on demand, including transparent or non-transparent rubber that is soft and elastic after curing and hard and rigid after curing.

There are several aspects to pay attention to when using LED encapsulants:

1. Before mixing the material, it is necessary to fully stir the agent A. Agent B is sealed and can be shaken evenly before use.

2. If you want to bond to a certain material, you should distinguish it to see if the LED potting adhesive can play a bonding role in the application material.

3. When mixing, mix the AB agent according to the weight ratio of 10:1. If you want to change this ratio, you need to conduct an experiment, and the experimental effect is not a problem before you can continue to use it. If the amount of agent B is too much, the operating time and curing time will be shortened.

4. If the potting thickness is less than 20 mm, there is no need for deaeration, and it can be degassed automatically. If this thickness is exceeded, bubbles may be formed and evacuation will be required.

5. Normally, heating and curing are not recommended. After curing after heating, the surface will blister, which will affect the sealing effect.

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A glue B glue is mixed and blended in proportion Potting glue manufacturers have a proportion description.

According to the amount of usage at that time,

When mixing glue, it should be decided according to the amount used at that time

How to use LED potting compound.

1 Preparation. Before use, be sure to stir the rubber up and down evenly to check whether the vulcanizing agent is invalid. The parts that need to be filled are best wiped clean with solvents such as absolute ethanol and acetone.

2 Weighing. Add 10 parts of supporting vulcanizing agent for every 100 weight parts of rubber compound. Appropriately increase or decrease the amount of vulcanizing agent, the application period will be shortened or extended accordingly, and the performance of the vulcanized rubber will also change slightly.

3 Mix. Mix the two components of the rubber compound thoroughly, and pay attention to scratching the bottom and side walls of the mixing container.

4 Degassing. In order to ensure that there are no bubble defects in the vulcanized rubber, the mixed rubber material and the mixing container are placed in the vacuum foaming equipment, and the vacuum is evacuated for deaeration treatment. During vacuum defoaming, the liquid level of the mixture may rise to 3 to 4 times the original volume, and then automatically burst and collapse. After the bubble is broken, the vacuum is maintained for 4 to 6 minutes, and the vacuum is finally released.

5 Potting. The rubber is poured manually or mechanically, and it is best to deaeration by vacuum after filling. After the rubber compound is added to the vulcanizing agent, the vulcanization cross-linking reaction begins, and the viscosity gradually increases with time, and the viscosity of the rubber material may increase to the point that it is difficult to use after 1 hour at room temperature, so it should be used within 40 minutes after the glue is dispensed.

6 Vulcanization. The rubber compound is basically vulcanized after 3 to 4 hours at room temperature, and it reaches complete vulcanization after 24 hours. If there are high requirements for electrical performance, it is recommended to carry out relevant testing and follow-up operations after one week. It can also be used to heat vulcanization 80 2 4 hours after the initial vulcanization into rubber (that is, after 24 hours at room temperature) to accelerate the complete vulcanization of the rubber compound.

Precautions for LED potting compounds.

1.It will be loaded on an aluminum boat in a certain direction. After blowing dust, it is placed in an oven for 125 to 40 minutes for preheating.

2.According to the demand of production, the glue is matched, and then the prepared glue is stirred evenly and placed in a vacuum oven for 45 15 minutes for deaeration.

3.Glue filling is carried out, and then the initial roasting is carried out (3, 5 The initial roasting temperature of the product is 125 60 minutes; 8 10 The initial roasting temperature of the product is 110 30 minutes + 125 30 minutes).

4.Remove from the mold, after a long roast for 125 for 6-8 hours.

What exactly is the phenomenon? That parameter is not normal, so you can find out what is causing it.

The heat conductivity should be good, and it has no effect on the current.

OS 925 (A B) Imported Silicone Potting Adhesive Silicone Flame Retardant Thermal Conductive Liquid Encapsulant is a two-component addition thermally conductive silicone rubber specially designed for potting electronic and electrical components and electrical components. OS 925 (A B) imported silicone potting adhesive product has the characteristics of good fluidity, moderate operation time, easy operation when used (the two components are mixed in equal proportions) after curing, and has the characteristics of small shrinkage, good high temperature resistance, good flame retardancy, good thermal conductivity, good anti-sulfur return and good dielectric properties when used in a closed manner at high temperature. The two components are as follows a:

b=1:1 (weight ratio) can be used by mixing, the product has better catalytic activity than the general addition molding potting compound, better anti-"poisoning", has two ways to choose from room temperature and medium temperature curing, is non-corrosive to metal and non-metallic materials, and can be cured at the same time inside and outside.