What are the reasons why the use of potting compound does not cure

Why don't silicone encapsulants cure?

1. The electronic scale is not accurate enough, resulting in the incorrect content of AB agent. When there is too much agent A and less content of agent B, it cannot be cured normally.

2. The curing time is not long enough, so the next step is carried out in a hurry. Or the curing temperature is too low, so that the adhesive cannot complete the curing for a long time. Especially in winter, when the temperature is low, the curing time needs to be extended.

3. The adhesive is expired, and there may be qualitative changes after the expiration date, and it cannot be used normally. Check the expiration date before use and do not use expired products. Cooperate with powerful businessmen to be more assured, Xishun Silicone focuses on the research of silicone potting adhesive, provides customized silicone potting adhesive application solutions, has a wide range of uses, and can be used in new energy, military industry, medical, aviation, shipbuilding, electronics, automobiles, instruments, power supply, high-speed rail and other industries.

4. During use, it may be in contact with compounds such as nitrogen, phosphorus or sulfur, and may also be in contact with unsaturated polyester or polyurethane and other products, resulting in "poisoning".

How to solve the problem of non-curing?

1. Regularly calibrate the electronic scale, weigh the AB agent accurately, and stir it evenly.

2. After winter, the adhesive can be preheated or heated and cured.

3. Arrange the adhesive according to the length of the shelf life, and use up the products that are about to expire to avoid waste.

4. The working environment should be kept safe, and products that will react with silicone potting adhesive should be kept away.

5. Store in accordance with the provisions of the manual and maintain good ventilation conditions.

This is a poisoning phenomenon that belongs to the thermal conductive encapsulant! Thermally conductive encapsulants may not cure or not fully cure when exposed to certain substances, including: sulfur, phosphorus, nitrogen-water compounds, water, organic salts, etc.

It is usually caused by the customer's flux, rosin and other substances that affect the activity of PT not being cleaned, or it may be that the customer's circuit board is sprayed with a layer of conformal coating, and some of the conformal coating contains ingredients that cause catalyst poisoning. In addition, if the operator smokes before the operation, be sure to wash his hands with soap before operating, because there will be sulfur residue on his hands when smoking. If you still have any questions, please contact Guangdong Schnees Group****.

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The solution to solidify the pro-potting adhesive A after a long time is as follows: the solution is to heat the solidified or agglomerated components of the polyurethane potting compound at a high temperature, such as 60 or 80, and then restore the liquid state and use normally. Potting is to pour liquid polyurethane compounds into devices equipped with electronic components and circuits mechanically or manually, and solidify them into thermosetting polymer insulating materials with excellent performance at room temperature or heating conditions.

The liquid polyurethane compound used in this process is the encapsulant. Encapsulants are used for bonding, sealing, potting and coating protection of electronic components. Before curing, the encapsulant is liquid and fluid, and the viscosity of the glue varies according to the material, performance and production process of the product.

After the potting compound is completely cured, it can realize its use value, and after curing, it can play the role of waterproof, moisture-proof, dust-proof, insulation, thermal conductivity, confidentiality, anti-corrosion, temperature resistance, and shockproof. There are many types of electronic potting compounds, which are divided into three types of material types, namely epoxy resin potting compound, silicone resin potting compound, and polyurethane potting compound, and these three materials can be subdivided into hundreds of different products. Potting is an important application area for polyurethane resins.

It has been widely used in the manufacturing of electronic devices and is an indispensable and important insulating material in the electronics industry. I hope my wheel can help you <>

Do you have any other questions?

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If the viscosity of the potting compound is too low, the potting compound will become like a liquid, with strong fluidity, which is difficult to control and locate, which is easy to cause uneven potting and affect product quality. A decrease in the viscosity of the encapsulant may reduce its adhesion and prevent it from achieving the required firmness and sealing performance for design.

What happens if the potting adhesive is too low.

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If the viscosity of the potting compound is too low, the potting glue will become like a liquid, and the fluidity is very strong, which is difficult to control the excitement and positioning, and the high socks are easy to cause uneven potting and affect the product quality. A decrease in the viscosity of the encapsulant may reduce its adhesion and prevent it from achieving the required firmness and sealing performance for design.

The extended potting compound is as follows: potting is to pour the liquid polyurethane composite Libo lead into the device equipped with electronic components and circuits by mechanical or manual means, and solidify it into a thermosetting polymer insulating material with excellent performance under room temperature or heating conditions. The liquid polyurethane compound used in this process is the encapsulant.

Summary. Hello dear, glad to answer for you. If the potting compound is too low, it will reduce the adhesion.

The glue concentration will be related to the glue use time and the amount of glue is a factor, the glue is too viscous will not be able to brush the glue can not be bonded and cured, and the concentration is too low will cure too fast, the operation time of the glue becomes shorter, and the glue is wasted. As a result, the viscosity of the adhesive formulation is too low, resulting in a decrease in leveling, which can sometimes seriously hinder the wetting process and reduce the adhesion, and the amount of glue applied is insufficient, which affects the fastness of the compound.

Hello dear, glad to answer for you. The potting glue is viscous, the early key is low, and the opening of the foci is low, and the adhesion is low. The glue concentration will be related to the glue use time and the amount of glue is a factor, the glue is too viscous will not be able to brush the glue can not be bonded and cured, and the concentration is too low will cure too fast, the operation time of the glue becomes shorter, and the glue is wasted.

As a result, the viscosity of the adhesive formulation is too low, resulting in a decrease in leveling, which can sometimes seriously hinder the wetting process and reduce the adhesion, and the amount of glue applied is insufficient, which affects the fastness of the compound.

Hello dear, the expansion for you is as follows: the use of glue is as follows: First, daily use, such as doing handiwork, sticking notices on the wall, etc.

The second is industrial use, in the manufacture of some items, such as making furniture, leather bags, shoes, etc., glue parts and accessories need to be used to bond together. Third, there are many places where glue is used in the construction industry, and many projects are cracked with adhesives to ensure that the materials are tightly pasted together.

Users who use electronic potting glue often encounter the situation that the glue does not dry or dries slowly, and the reason for this phenomenon is mainly due to improper operation and not operating according to the instructions provided by the manufacturer, or the time has not arrived, and the curing time of the selected glue is very long. The following es silicone is introduced to you.

First, the electronic potting glue is not dry.

For the case of non-drying, we first judge whether you use a one-component potting compound or a two-component potting compound, if it is a single-component potting compound, then we see: whether it is heated in the way of simultaneous heating in the way of heat preservation Whether the time required for curing is reached; If it is a two-component potting glue, then we see: Whether the proportion is strict, whether the glue is evenly blended How long is the curing time, and whether it is not yet the time point of glue curing Potting is more and thicker than the glue used in general bonding, so even if it is the time on the instructions, maybe the glue has not completely cured.

Second, the electronic potting glue dries slowly.

If it dries slowly, the curing speed can be accelerated according to the ratio type of encapsulant, for 1:1 additive encapsulant, it can be cured by heating, and for condensed encapsulant with a mixing ratio of 100:10, the air humidity of the sizing environment can be increased.

and air circulation velocity to shorten the curing time.

To sum up: the reasons that affect the electronic potting compound not drying or drying slowly are:

1.The proportion is incorrect, and the manufacturer generally has a mass ratio, and the volume cannot be roughly proportioned.

2.If the mixing is uneven, it means that the stirring is not in place.

3.The time has not come, and some glues take a long time to cure.