How to use solder paste? How to clean flux paste?

One bottle. Solder paste.

Use it for a longer period of time and multiple times. Such.

Solder paste. is different from those large-scale production lines that use one, a few or even a few pick-ups at a time. One: solder paste.

Basic principles of use and storage.

The basic principle is to have as little contact with air as possible, as little as possible.

Solder paste. After prolonged contact with air, it will cause.

Solder paste. Oxidation, flux ratio and composition are out of balance. The consequences are:

Solder paste. Crust, lumps, refractory and large amounts of solder balls appear.

Two: a bottle. Solder paste.

Precautions for multiple uses.

1: The opening time should be as short as possible.

The opening time should be as short as possible, and it is enough to take it out on duty.

Solder paste. The inner lid should be closed immediately. Do not take a little, use a little, open the lid frequently or always leave the lid open.

2: Close the lid.

Remove. Solder paste.

After that, close the inner lid immediately, press down hard, and squeeze out the lid with.

Solder paste. between the whole air, make the inner cover with.

Solder paste. Close contact. After making sure that the inner cover is tightened, screw on the large outer cover.

3: Taken out.

Solder paste. Print as soon as possible.

Taken out. Solder paste.

It is necessary to implement printing as soon as possible. The printing work should be continuous without pause, and all the PCB boards to be processed on duty should be printed in one go, and placed flat on the workbench waiting for the surface mount components to be placed. Don't print stop.

4: The excess that has been removed.

Solder paste. processing.

After all the printing is done, the remainder.

Solder paste. It should be put into a special bottle as soon as possible, and kept in isolation from air as in precautions (2). Do not place the leftovers.

Solder paste. Put back unused.

Solder paste. Inside the bottle! Just in case"A piece of stinky meat spoiled in a pot"。Therefore in the access.

Solder paste. Try to estimate the shift as accurately as possible.

Solder paste. Usage, take as much as you want.

5: Handling of problems.

If it has appeared. Solder paste.

When the surface is crusty or hardened, do not stir it!! To fully remove the crust, hard lumps, the rest.

Solder paste. Before the official use, it is necessary to do a test to see how the trial effect is, if not, it can only be scrapped.

Conventional solder paste is developed by Hanjin Science and Technology for gas shielded brazing, vacuum brazing, flame brazing and high-frequency brazing of various materials such as copper, aluminum, stainless steel, carbon steel, cemented carbide, etc., with five series of more than 20 products. Conventional solder paste can meet the special requirements of the welding process, and has obtained national invention patents and has its own intellectual property rights. Conventional solder paste can be applied manually to the place to be welded, and can also be used for semi-automatic and automatic stencil printing and syringe quantitative injection, which is efficient and simple, and can quantitatively control the amount of solder paste, which greatly improves the work efficiency and product yield, and also improves the working environment.

Usually I use copper wire to clean it, but if you use solder paste, you can use a soldering iron tip to dip a little and then remove some excess solder, and you can get rid of it after it melts.

1. Use paste chemicals that play the two main roles of "removing oxides" and "reducing the surface tension of the welded material" in the welding process. Note: Do not wash with water.

2. The lower cost of Wuyu is to clean it with gasoline or diesel, and then if the gasoline and diesel leave stains, then clean it with alcohol.

3. The higher cost method is to clean with wiping machine water, Tianna water, and industrial alcohol.

The function of solder paste is to enhance electrical conductivity, inhibit oxidation, and enhance adhesion.

1. Enhance electrical conductivity.

Solder paste can enhance the conductivity between the solder joints. When the solder surface is coated with a layer of solder paste, the solder melts and fills the internal void of the solder terminal during the heating and cooling process, thereby increasing the contact area and increasing the conductivity.

2. Inhibit oxidation.

The oxidant in the solder paste can remove the oxide layer on the metal surface and avoid the joint surface from reacting with the external environment, thereby inhibiting oxidation. At the same time, solder paste containing active cleaning agents can also remove surface dirt and further improve solder quality.

3. Enhance adhesion.

The resin in the solder paste can enhance the adhesion between the solder and the solder surface, preventing quality problems such as solder joints separating from the circuit board or virtual soldering. In addition, the presence of resin also contributes to the improvement of solder attachment, making the solder paste more uniform when applied.

How to use solder paste

1. Add about 2 3 amounts of solder paste to the steel plate, and try to keep the amount of no more than 1 can on the steel plate.

2. Depending on the production speed, the amount of solder paste on the steel plate is supplemented by adding a small amount of times to maintain the quality of the solder paste.

3. The used solder paste on the same day should not be placed together with the unused solder paste, and should be stored in another container. After opening, it is recommended to use up the solder paste within 24 hours at room temperature.

4. When using it the next day, the newly opened solder paste should be used first, and the unused solder paste and the new solder paste should be stirred and mixed in a ratio of 1:2, and added and used in a small amount and many times.

5. After the solder paste is printed on the substrate, it is recommended to place the parts into the reflow oven within 4-6 hours to complete the dressing.

6. If the line is changed for more than 1 hour, please scrape the solder paste from the steel plate and put it into the solder paste can to seal the lid before changing the line.

The solder paste model is different for each solder paste brand.

Flux paste: widely used in the brazing of clocks and watches, precision parts, medical equipment, stainless steel handicrafts, tableware, mobile communications, digital products, air conditioning and refrigerator refrigeration equipment, glasses, knives, automobile radiators and various PCB boards and BGA solder balls.

In the welding process, it plays two main roles: "removing oxides" and "reducing the surface tension of the welded material". It is widely used in clocks and watches, precision parts, medical equipment, stainless steel handicrafts, tableware, mobile communications, digital products, air conditioning and refrigerator refrigeration equipment, glasses, cutting tools, automobile radiators and various PCB boards and BGA solder balls.

Removal of surface oxides.

Because of the oxygen content of the atmosphere, the various substances are actually surrounded by a layer of oxides, which is about 2 10-9 2 10-8 m thick. During welding, the oxide film will inevitably prevent the solder from wetting the base metal, and the welding can not be carried out normally, so the flux must be coated on the surface of the base metal to reduce the oxide on the surface of the base metal, so as to achieve the purpose of eliminating the oxide film.

On the other hand, the high temperature of welding can easily oxidize the surface of the welding material. Flux paste helps to stop the oxidation process.

Reduces the surface tension of the material.

The surface tension of the substance affects the quality of the weld, and another function of the flux paste is to reduce the tension of the material. The surface tension of the molten weld will prevent it from flowing to the surface of the base metal, affecting the normal wetting process. When the flux is applied to the surface of the molten solder, the surface tension of the liquid solder is reduced, and the wetting performance is significantly improved.